Presentation 2006/6/26
Progress in SiC Power Semiconductor Devices(Session 2 Compound Semiconductor Devices I,AWAD2006)
Takashi SHINOHE,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Silicon carbide (SiC) has an electric breakdown field ten times higher than that of silicon (Si) and is expected to be an excellent material for next-generation high-voltage, low-loss power devices. SBDs (Schottky Barrier Diodes) are already being produced commercially and are beginning to be included in switching mode power supplies. Many research organizations and companies are engaged in the research and development of switching devices such as MOSFETs and JFETs (Junction Field Effect Transistors). This paper presents an overview of the present status and future prospects of SiC power semiconductor devices, which are progressing steadily towards practical application.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) SiC / Power Semiconductor Devices / SBD / PiN / MOSFET / JFET / Transistor
Paper # ED2006-62,SDM2006-70
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Committee SDM
Conference Date 2006/6/26(1days)
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Registration To Silicon Device and Materials (SDM)
Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Progress in SiC Power Semiconductor Devices(Session 2 Compound Semiconductor Devices I,AWAD2006)
Sub Title (in English)
Keyword(1) SiC
Keyword(2) Power Semiconductor Devices
Keyword(3) SBD
Keyword(4) PiN
Keyword(5) MOSFET
Keyword(6) JFET
Keyword(7) Transistor
1st Author's Name Takashi SHINOHE
1st Author's Affiliation Toshiba Corporate R&D Center()
Date 2006/6/26
Paper # ED2006-62,SDM2006-70
Volume (vol) vol.106
Number (no) 138
Page pp.pp.-
#Pages 6
Date of Issue