Presentation 2006/6/26
High Density (256Mb and Beyond) PRAM Integration Using 3-D Cell Array Transistors(Plenary Session,AWAD2006)
Gitae Jeong, Kinam Kim,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) PRAM integration technologies using 3-D cell array transistor were proposed to realize the reliable high density 256Mb PRAM (Phase Change RAM) product. Introducing the 3-D cell array transistor, sufficient programming current with the good scalability and reliability was obtained. The cost effectiveness, reliability and performance in the product level will be reviewed.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) PRAM / 3-D transistor / Cost Effectiveness / Reliability
Paper # ED2006-58,SDM2006-66
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Conference Information
Committee SDM
Conference Date 2006/6/26(1days)
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Registration To Silicon Device and Materials (SDM)
Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) High Density (256Mb and Beyond) PRAM Integration Using 3-D Cell Array Transistors(Plenary Session,AWAD2006)
Sub Title (in English)
Keyword(1) PRAM
Keyword(2) 3-D transistor
Keyword(3) Cost Effectiveness
Keyword(4) Reliability
1st Author's Name Gitae Jeong
1st Author's Affiliation Advanced Technology Development 2, Memory Device Business, Samsung Electronics Co.()
2nd Author's Name Kinam Kim
2nd Author's Affiliation Advanced Technology Development 2, Memory Device Business, Samsung Electronics Co.
Date 2006/6/26
Paper # ED2006-58,SDM2006-66
Volume (vol) vol.106
Number (no) 138
Page pp.pp.-
#Pages 4
Date of Issue