| Presentation | 2006-06-30 Solubility parameter of polymer material and examination concerning adhesion. Makito MORII, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | The mechanical device combines various materials, and achieves the function. The joint by the oak and bonding is used as the miniaturization of the equipment advances. As for the joint by bonding, the method of using the adhesive is general. The method of dissolving with the solvent when the object is a polymeric material and making it connect is used. It is difficult to still clarify the true cause though a lot of researches have been performed as for the mechanism of bonding since the past. The author evaluated bonding by using the wet character and the solubility parameter of the material as one parameter that took part in the mechanism of bonding. As a result, it was confirmed that the wet character became excellent in the solvent that in the wet character and the solubility parameter of the resin material the correlations, and approached the solubility parameter, and adhesive power grew, too.. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | wetting parameter / solubility parameter / resin / solvent / polymer / adhesive |
| Paper # | EMD2006-10,CPM2006-34,OME2006-44 |
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| Conference Information | |
| Committee | CPM |
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| Conference Date | 2006/6/23(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
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| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Solubility parameter of polymer material and examination concerning adhesion. |
| Sub Title (in English) | |
| Keyword(1) | wetting parameter |
| Keyword(2) | solubility parameter |
| Keyword(3) | resin |
| Keyword(4) | solvent |
| Keyword(5) | polymer |
| Keyword(6) | adhesive |
| 1st Author's Name | Makito MORII |
| 1st Author's Affiliation | OMRON CO. LTD.:ELECTRONIC COMPONENTS COMPANY TECHNOLOGY MANAGEMENT DEPT. ENGINEERING CENTER() |
| Date | 2006-06-30 |
| Paper # | EMD2006-10,CPM2006-34,OME2006-44 |
| Volume (vol) | vol.106 |
| Number (no) | 131 |
| Page | pp.pp.- |
| #Pages | 4 |
| Date of Issue | |