Presentation 2006-06-22
Solution Space Reduction of Sequence Pairs using Model Placement
Mineo KANEKO,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) Sequence Pair is a code system to represent a placement of modules on a plane, and is now recognized as one of promising frameworks for VLSI placement and floorplan. This paper proposes a reduced solution space for the sequence-pair based placement. Assuming that a model placement is given, we will extract relative spatial relation between modules from it. Based on this analysis, we will impose some constraints on permutations Γ_+ and Γ_- of modules in a sequence pair code in order to reduce the solution space while keeping good solutions (configurations of the sequence pair). Constraints are given as partial orders on modules, which govern available configurations of Γ_+ and Γ_-. As a result, the solution space is reduced to the set of pairs of topological orders for those partial orders.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Sequence pair / module placement / relative spatial relation / solution space reduction / simulated annealing
Paper # CAS2006-5,VLD2006-18,SIP2006-28
Date of Issue

Conference Information
Committee VLD
Conference Date 2006/6/15(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To VLSI Design Technologies (VLD)
Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Solution Space Reduction of Sequence Pairs using Model Placement
Sub Title (in English)
Keyword(1) Sequence pair
Keyword(2) module placement
Keyword(3) relative spatial relation
Keyword(4) solution space reduction
Keyword(5) simulated annealing
1st Author's Name Mineo KANEKO
1st Author's Affiliation Graduate School of Information Science, Japan Advanced Institute of Science and Technology()
Date 2006-06-22
Paper # CAS2006-5,VLD2006-18,SIP2006-28
Volume (vol) vol.106
Number (no) 113
Page pp.pp.-
#Pages 4
Date of Issue