| Presentation | 2006-06-22 Modeling of Layout Dependent Copper Electrochemical Plating Daisuke FUKUDA, Hidetoshi MATSUOKA, Toshiyuki SHIBUYA, |
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| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | In VLSI (Very Large Scale Integrated Circuit) fabrication using copper(Cu) process, electrochemical plating (ECP) and chemical mechanical planarization (CMP) are techniques to make copper interconnect pattern. From the point of view of DFM, it is necessary to estimate Cu and Oxide thickness variation more accurately. In this paper, we make clear the reason of inaccuracy of old model and propose the enhanced model of ECP estimation depending on layout pattern. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | ECP / CMP / DFM |
| Paper # | CAS2006-2,VLD2006-15,SIP2006-25 |
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| Conference Information | |
| Committee | VLD |
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| Conference Date | 2006/6/15(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
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| Paper Information | |
| Registration To | VLSI Design Technologies (VLD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Modeling of Layout Dependent Copper Electrochemical Plating |
| Sub Title (in English) | |
| Keyword(1) | ECP |
| Keyword(2) | CMP |
| Keyword(3) | DFM |
| 1st Author's Name | Daisuke FUKUDA |
| 1st Author's Affiliation | FUJITSU LABORATORIES LTD.() |
| 2nd Author's Name | Hidetoshi MATSUOKA |
| 2nd Author's Affiliation | FUJITSU LABORATORIES LTD. |
| 3rd Author's Name | Toshiyuki SHIBUYA |
| 3rd Author's Affiliation | FUJITSU LABORATORIES LTD. |
| Date | 2006-06-22 |
| Paper # | CAS2006-2,VLD2006-15,SIP2006-25 |
| Volume (vol) | vol.106 |
| Number (no) | 113 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |