| Presentation | 2006-06-08 The need of collaboration between the computer architecture and the integrated circuit technology Hisashige Ando, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | With the scaling of semiconductor process, increase in power dissipation, leakage current, soft error and so on, becomes a significant issue in computer design. It becomes increasingly difficult to achieve low power dissipation, and both reasonable yield and high operational reliability by overcoming these negative side effects of the scaling. These issues can only be addressed with the close cooperation among the semiconductor engineers, circuit engineers and architects. This presentation addresses these scaling related issues and possible solutions. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Semiconductor scaling / Power dissipation / Device variability / Soft error / Computer architecture |
| Paper # | ICD2006-44 |
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| Conference Information | |
| Committee | ICD |
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| Conference Date | 2006/6/1(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
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| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | The need of collaboration between the computer architecture and the integrated circuit technology |
| Sub Title (in English) | |
| Keyword(1) | Semiconductor scaling |
| Keyword(2) | Power dissipation |
| Keyword(3) | Device variability |
| Keyword(4) | Soft error |
| Keyword(5) | Computer architecture |
| 1st Author's Name | Hisashige Ando |
| 1st Author's Affiliation | Fujitsu Ltd.() |
| Date | 2006-06-08 |
| Paper # | ICD2006-44 |
| Volume (vol) | vol.106 |
| Number (no) | 92 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |