| Presentation | 2006-05-19 Wafer Scale Integration and Reconfigurable Systems Susumu Horiguchi, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | It has been continued to implement much more circuits on a chip and high functional system in a silicon wafer since the commercialization of integrated circuits from the late 1970s. During 1980s to 1990s, it was reported that Wafer scale integration (WSI) had several attractive advantages; high speed, lower power consumption, fewer chip-to-chip bottlenecked, smaller size, higher reliability and lower system cost. Thus many WSI systems such as 3D-Computer, large scale multi-processor systems, high functional image processing systems and MEMs interated devices were implemented in research as well as in commercial products. This paper summarizes research trend of WSI devices during 1980s to 1990s and discuss the new era of reconfigurable computing. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | WSI / Reconfigurable / Redundancy Architecture / Fault and Defect Tolerances / WSI system / Reconfigurable Computing |
| Paper # | RECONF2006-15 |
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| Conference Information | |
| Committee | RECONF |
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| Conference Date | 2006/5/12(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
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| Paper Information | |
| Registration To | Reconfigurable Systems (RECONF) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Wafer Scale Integration and Reconfigurable Systems |
| Sub Title (in English) | |
| Keyword(1) | WSI |
| Keyword(2) | Reconfigurable |
| Keyword(3) | Redundancy Architecture |
| Keyword(4) | Fault and Defect Tolerances |
| Keyword(5) | WSI system |
| Keyword(6) | Reconfigurable Computing |
| 1st Author's Name | Susumu Horiguchi |
| 1st Author's Affiliation | Graduate School of Information Sciences Tohoku University() |
| Date | 2006-05-19 |
| Paper # | RECONF2006-15 |
| Volume (vol) | vol.106 |
| Number (no) | 50 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |