Presentation 2006-05-18
Three-Dimensional Integration Technology and Reconfigurable 3D-SoC
Mitsumasa KOYANAGI, Takeaki SUGIMURA, Takafumi FUKUSHIMA, Tetsu TANAKA,
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Abstract(in English) The increases of signal propagation delay and power consumption by interconnections in LSIs make it difficult to achieve a high performance LSI with low power consumption. To solve such interconnection problem, we have developed a new three-dimensional (3D) integration technology based on wafer bonding method. We can reduce the pin capacitances and the wiring length by using this new 3D integration technology. Therefore, we can increase the signal processing speed and decrease the power consumption. This 3D integration technology is also useful to increase the wiring connectivity within a chip. We have proposed various kinds of new reconfigurable system-on-a chip (reconfigurable 3D-SoC) based on our 3D integration technology. In this report, we describe a new parallel reconfigurable image processor with 3D structure for a real-time robot vision system as a typical example of these reconfigurable 3D-SoCs. The proposed reconfigurable processor can dynamically reconfigure its function, and has scalable architecture for input image size. Therefore, it is expected that the parallel reconfigurable image processor with implementation of image processing algorithms for robot vision can actualize advanced robot vision systems with high performance.
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Keyword(in English) Three-Dimensional (3D) LSI / wafer bonding / robot vision / reconfigurable computing / image processing
Paper # RECONF2006-3
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Committee RECONF
Conference Date 2006/5/11(1days)
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Registration To Reconfigurable Systems (RECONF)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Three-Dimensional Integration Technology and Reconfigurable 3D-SoC
Sub Title (in English)
Keyword(1) Three-Dimensional (3D) LSI
Keyword(2) wafer bonding
Keyword(3) robot vision
Keyword(4) reconfigurable computing
Keyword(5) image processing
1st Author's Name Mitsumasa KOYANAGI
1st Author's Affiliation Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University()
2nd Author's Name Takeaki SUGIMURA
2nd Author's Affiliation Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University
3rd Author's Name Takafumi FUKUSHIMA
3rd Author's Affiliation Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University
4th Author's Name Tetsu TANAKA
4th Author's Affiliation Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University
Date 2006-05-18
Paper # RECONF2006-3
Volume (vol) vol.106
Number (no) 49
Page pp.pp.-
#Pages 6
Date of Issue