Presentation | 2006-05-18 Three-Dimensional Integration Technology and Reconfigurable 3D-SoC Mitsumasa KOYANAGI, Takeaki SUGIMURA, Takafumi FUKUSHIMA, Tetsu TANAKA, |
---|---|
PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | The increases of signal propagation delay and power consumption by interconnections in LSIs make it difficult to achieve a high performance LSI with low power consumption. To solve such interconnection problem, we have developed a new three-dimensional (3D) integration technology based on wafer bonding method. We can reduce the pin capacitances and the wiring length by using this new 3D integration technology. Therefore, we can increase the signal processing speed and decrease the power consumption. This 3D integration technology is also useful to increase the wiring connectivity within a chip. We have proposed various kinds of new reconfigurable system-on-a chip (reconfigurable 3D-SoC) based on our 3D integration technology. In this report, we describe a new parallel reconfigurable image processor with 3D structure for a real-time robot vision system as a typical example of these reconfigurable 3D-SoCs. The proposed reconfigurable processor can dynamically reconfigure its function, and has scalable architecture for input image size. Therefore, it is expected that the parallel reconfigurable image processor with implementation of image processing algorithms for robot vision can actualize advanced robot vision systems with high performance. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Three-Dimensional (3D) LSI / wafer bonding / robot vision / reconfigurable computing / image processing |
Paper # | RECONF2006-3 |
Date of Issue |
Conference Information | |
Committee | RECONF |
---|---|
Conference Date | 2006/5/11(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | |
Chair | |
Vice Chair | |
Secretary | |
Assistant |
Paper Information | |
Registration To | Reconfigurable Systems (RECONF) |
---|---|
Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Three-Dimensional Integration Technology and Reconfigurable 3D-SoC |
Sub Title (in English) | |
Keyword(1) | Three-Dimensional (3D) LSI |
Keyword(2) | wafer bonding |
Keyword(3) | robot vision |
Keyword(4) | reconfigurable computing |
Keyword(5) | image processing |
1st Author's Name | Mitsumasa KOYANAGI |
1st Author's Affiliation | Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University() |
2nd Author's Name | Takeaki SUGIMURA |
2nd Author's Affiliation | Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University |
3rd Author's Name | Takafumi FUKUSHIMA |
3rd Author's Affiliation | Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University |
4th Author's Name | Tetsu TANAKA |
4th Author's Affiliation | Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University |
Date | 2006-05-18 |
Paper # | RECONF2006-3 |
Volume (vol) | vol.106 |
Number (no) | 49 |
Page | pp.pp.- |
#Pages | 6 |
Date of Issue |