| Presentation | 2006/1/30 Influence of Cu-CMP Process on Defects in SiOC Films and TDDB Reliability Nobuhiro Konishi, Youhei Yamada, Junji Noguchi, Tomoko Jimbo, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | The relationship between the TDDB reliability and defects in the Cu-CMP process, such as corrosions, scratches and pitting, was investigated using Cu/SiOC interconnects. Scratches on the SiOC surface degrade the TDDB lifetime. Cu corrosions generate at edges of wires and this also results in the TDDB degradation. The slurry without the BTA solutions causes not only pitting but also Cu dissolution. In this condition some dissolved Cu atoms remain on the SiOC surface between adjacent Cu wires. This also leads to the TDDB degradation. It is essential to prevent scratches, corrosions and pitting to improve the TDDB reliability. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | CMP / Cu / SiOC / TDDB / Defects / Scratches / Corrosions / Pitting / Reliability |
| Paper # | SDM2005-255 |
| Date of Issue |
| Conference Information | |
| Committee | SDM |
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| Conference Date | 2006/1/30(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Silicon Device and Materials (SDM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Influence of Cu-CMP Process on Defects in SiOC Films and TDDB Reliability |
| Sub Title (in English) | |
| Keyword(1) | CMP |
| Keyword(2) | Cu |
| Keyword(3) | SiOC |
| Keyword(4) | TDDB |
| Keyword(5) | Defects |
| Keyword(6) | Scratches |
| Keyword(7) | Corrosions |
| Keyword(8) | Pitting |
| Keyword(9) | Reliability |
| 1st Author's Name | Nobuhiro Konishi |
| 1st Author's Affiliation | Micro Device Devision, Hitachi, Ltd.() |
| 2nd Author's Name | Youhei Yamada |
| 2nd Author's Affiliation | Micro Device Devision, Hitachi, Ltd. |
| 3rd Author's Name | Junji Noguchi |
| 3rd Author's Affiliation | Micro Device Devision, Hitachi, Ltd. |
| 4th Author's Name | Tomoko Jimbo |
| 4th Author's Affiliation | Micro Device Devision, Hitachi, Ltd. |
| Date | 2006/1/30 |
| Paper # | SDM2005-255 |
| Volume (vol) | vol.105 |
| Number (no) | 598 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |