Presentation 2006/1/30
Deoxidization of Cu Oxide under Extremely Low Oxygen Pressure
Kazuhiko Endo, Naoki Shirakawa, Yoshiyuki Yoshida, Shin-ichi Ikeda, Tetsuya Mino, Eishi Gofuku, Eiichi Suzuki,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) Deoxidization of Cu oxide has been carried out in an extremely low oxygen partial pressure atmosphere for the first time. The oxygen was evacuated to 10^<-28> atm by using the newly developed oxygen reduction system. It was experimentally demonstrated that the surface oxide of Cu film was completely removed by exposure to such an environment at 200℃. The proposed deoxidization reaction can be used as a new Cu surface cleaning technique.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) copper / oxide / cleaning / oxygen partial pressure
Paper # SDM2005-254
Date of Issue

Conference Information
Committee SDM
Conference Date 2006/1/30(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Deoxidization of Cu Oxide under Extremely Low Oxygen Pressure
Sub Title (in English)
Keyword(1) copper
Keyword(2) oxide
Keyword(3) cleaning
Keyword(4) oxygen partial pressure
1st Author's Name Kazuhiko Endo
1st Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)()
2nd Author's Name Naoki Shirakawa
2nd Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
3rd Author's Name Yoshiyuki Yoshida
3rd Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
4th Author's Name Shin-ichi Ikeda
4th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
5th Author's Name Tetsuya Mino
5th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
6th Author's Name Eishi Gofuku
6th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
7th Author's Name Eiichi Suzuki
7th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
Date 2006/1/30
Paper # SDM2005-254
Volume (vol) vol.105
Number (no) 598
Page pp.pp.-
#Pages 5
Date of Issue