Presentation | 2006/1/30 Cu surface treatment using a hot-filament hydrogen radical source Eiichi KONDOH, Masaya FUKASAWA, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | In response to miniaturization in ULSI processing down to nano scale, novel and gentle approaches have become concerned to replace conventional ways using energetic and/or charged particles. The hot filament is a conventional radical source that has been used in molecular bean epitaxy and chemical vapor deposition. Using the hot filament has been recently gaining much attention in view of ULSI processing because of its easiness in solving the aforementioned issues. However, a limited number of studies have been published in the field of back-end-of-the-line processing. This study intends to apply a hot filament hydrogen radical source to Cu surface cleaning. As a case study, we demonstrate the reduction of sputtered CuO and thermally-oxidized Cu to metallic Cu. A very short exposure to the radical source resulted in the formation of several tens of nm metallic Cu. The reduction temperature needed was below 150C, which was found to be much lower than the reduction temperature using molecular hydrogen. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | hot filament / hydrogen radicals / Cu / Cu oxide |
Paper # | SDM2005-253 |
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Conference Information | |
Committee | SDM |
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Conference Date | 2006/1/30(1days) |
Place (in Japanese) | (See Japanese page) |
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Topics (in Japanese) | (See Japanese page) |
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Paper Information | |
Registration To | Silicon Device and Materials (SDM) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Cu surface treatment using a hot-filament hydrogen radical source |
Sub Title (in English) | |
Keyword(1) | hot filament |
Keyword(2) | hydrogen radicals |
Keyword(3) | Cu |
Keyword(4) | Cu oxide |
1st Author's Name | Eiichi KONDOH |
1st Author's Affiliation | Yamanashi University() |
2nd Author's Name | Masaya FUKASAWA |
2nd Author's Affiliation | Yamanashi University |
Date | 2006/1/30 |
Paper # | SDM2005-253 |
Volume (vol) | vol.105 |
Number (no) | 598 |
Page | pp.pp.- |
#Pages | 5 |
Date of Issue |