Presentation 2006/1/30
Film Characterization and Integration of UV Cured Ultra Low-k for 45nm Node Cu/Low-k Interconnects
Kinya Goto, Shinobu Hashii, Masahiro Matsumoto, Noriko Miura, Takeshi Furusawa, Masazumi Matsuura, Akihiko Ohsaki,
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Abstract(in English) In order to obtain reliable Cu/Low-k interconnect systems, we have investigated the curing mechanisms of UV on Low-k films. By using optimized cure conditions, the Low-k film characteristics improved significantly. In this paper, we discuss the UV cure mechanisms focused on the bond structure in UV cured Low-k films in detail, using the FT-IR and NMR methods. We present the comparison results of 2 types of UV lamps and suggest the successful choice of UV lamp. We also mention the improved adhesion of film stack structure when using UV cure. Finally, by using UV cured ULK, a high performance Cu/Low-k interconnect was realized without the inclusion of a high-k capping layer.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) UV / ultra violet / cure / Low-k / ULK / SiCN / SiCO / modulus / k-value
Paper # SDM2005-250
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Committee SDM
Conference Date 2006/1/30(1days)
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Paper Information
Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Film Characterization and Integration of UV Cured Ultra Low-k for 45nm Node Cu/Low-k Interconnects
Sub Title (in English)
Keyword(1) UV
Keyword(2) ultra violet
Keyword(3) cure
Keyword(4) Low-k
Keyword(5) ULK
Keyword(6) SiCN
Keyword(7) SiCO
Keyword(8) modulus
Keyword(9) k-value
1st Author's Name Kinya Goto
1st Author's Affiliation Renesas Technology Corp.()
2nd Author's Name Shinobu Hashii
2nd Author's Affiliation Renesas Semiconductor Engineering Corp.
3rd Author's Name Masahiro Matsumoto
3rd Author's Affiliation Renesas Technology Corp.
4th Author's Name Noriko Miura
4th Author's Affiliation Renesas Technology Corp.
5th Author's Name Takeshi Furusawa
5th Author's Affiliation Renesas Technology Corp.
6th Author's Name Masazumi Matsuura
6th Author's Affiliation Renesas Technology Corp.
7th Author's Name Akihiko Ohsaki
7th Author's Affiliation Renesas Technology Corp.
Date 2006/1/30
Paper # SDM2005-250
Volume (vol) vol.105
Number (no) 598
Page pp.pp.-
#Pages 5
Date of Issue