Presentation 2006-01-20
90 Degree Hybrid with Insensitivity to Misalignment and Thickness Variation of Multi-layered LTCC Substrate
Takeshi YUASA, Yukihiro TAHARA, Hideyuki OHHASHI,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) 90 degree hybrid in multi-layered low temperature co-fired ceramic (LTCC) substrate which is insensitive to misalignment of conductor patterns and to thickness variation of each layer is investigated. It is shown that a tandem type coupler with ground walls is useful for avoiding the variation of coupling characteristics. Moreover experimental results show that the hybrid characteristics have good agreement with designed results in spite of thickness error so this type of hybrid is useful for high yield RF modules.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) LTCC / multi-layered substrate / hybrid / error
Paper # ED2005-214,MW2005-168
Date of Issue

Conference Information
Committee ED
Conference Date 2006/1/13(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To Electron Devices (ED)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) 90 Degree Hybrid with Insensitivity to Misalignment and Thickness Variation of Multi-layered LTCC Substrate
Sub Title (in English)
Keyword(1) LTCC
Keyword(2) multi-layered substrate
Keyword(3) hybrid
Keyword(4) error
1st Author's Name Takeshi YUASA
1st Author's Affiliation Information Technology R&D Center, Mitsubishi Electric Corporation()
2nd Author's Name Yukihiro TAHARA
2nd Author's Affiliation Information Technology R&D Center, Mitsubishi Electric Corporation
3rd Author's Name Hideyuki OHHASHI
3rd Author's Affiliation Information Technology R&D Center, Mitsubishi Electric Corporation
Date 2006-01-20
Paper # ED2005-214,MW2005-168
Volume (vol) vol.105
Number (no) 522
Page pp.pp.-
#Pages 5
Date of Issue