Presentation 2002/6/24
Double-Gate Poly-Si Thin-Film Transistors Fabricated Using Self-Aligned Technology
Kenji MAKIHIRA, Kousuke NAKAGAWA, Tanemasa ASANO,
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Abstract(in English) Double-gate TFTs having a buried bottom-gate were fabricated using a new self-aligned process. The photolithography for the top-gate was performed using the bottom-gate as the photo-mask and by exposing from the backside of the quartz wafer. We have been able to fabricate perfectly self-aligned double-gate TFTs using 4 photo-masks; bottom-gate, field isolation, contact hole and metalization. Drain current of about 3-fold the drain current of single-gate operation was obtained by double-gate operation. Current drive was also increased by thinning TFT active layer. The threshold voltage for the single-gate operation was able to be varied by changing the bias of the other gate. Uniformity in threshold voltage was improved by double-gate operation.
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Keyword(in English) poly-Si / thin film transistor / double gate / self aligned technology
Paper # ED2002-156
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Committee ED
Conference Date 2002/6/24(1days)
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Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Double-Gate Poly-Si Thin-Film Transistors Fabricated Using Self-Aligned Technology
Sub Title (in English)
Keyword(1) poly-Si
Keyword(2) thin film transistor
Keyword(3) double gate
Keyword(4) self aligned technology
1st Author's Name Kenji MAKIHIRA
1st Author's Affiliation Center for Microelectronic Systems, Kyushu Institute of Technology()
2nd Author's Name Kousuke NAKAGAWA
2nd Author's Affiliation Center for Microelectronic Systems, Kyushu Institute of Technology
3rd Author's Name Tanemasa ASANO
3rd Author's Affiliation Center for Microelectronic Systems, Kyushu Institute of Technology
Date 2002/6/24
Paper # ED2002-156
Volume (vol) vol.102
Number (no) 175
Page pp.pp.-
#Pages 4
Date of Issue