Presentation | 2002/6/24 Novel Device Transfer Technology by Backside Etching (DTTBE) for High Performance Poly-Si TFTs on Plastic Substrate Ching-Fa Yeh, Shuo-Cheng Wang, Chien-Kai Huang, Yuan-Tung Dai, |
---|---|
PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | A novel method that makes it possible to transfer thin-film devices from Si wafers to glass or plastic substrate has been investigated. First, high performance poly-Si TFTs were fabricated on the Si wafer and then adhered to glass or plastic substrates. The remaining Si was removed delicately using wafer backside CMP and wet chemical etching. The transferred devices exhibit no electrical degradation or yield loss. Therefore, for high-quality display application on low-melting temperature substrates, the novel transfer technique is quite attractive because of no process temperature limitation and the fully compatibility with conventional CMOS technology. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | thin-film transistor / glass substrate / plastic substrate / CMP / wet etching |
Paper # | ED2002-152 |
Date of Issue |
Conference Information | |
Committee | ED |
---|---|
Conference Date | 2002/6/24(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | |
Chair | |
Vice Chair | |
Secretary | |
Assistant |
Paper Information | |
Registration To | Electron Devices (ED) |
---|---|
Language | ENG |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Novel Device Transfer Technology by Backside Etching (DTTBE) for High Performance Poly-Si TFTs on Plastic Substrate |
Sub Title (in English) | |
Keyword(1) | thin-film transistor |
Keyword(2) | glass substrate |
Keyword(3) | plastic substrate |
Keyword(4) | CMP |
Keyword(5) | wet etching |
1st Author's Name | Ching-Fa Yeh |
1st Author's Affiliation | Department of Electronics Engineering & Institute of Electronics, National Cbiao-Tung University() |
2nd Author's Name | Shuo-Cheng Wang |
2nd Author's Affiliation | Department of Electronics Engineering & Institute of Electronics, National Cbiao-Tung University |
3rd Author's Name | Chien-Kai Huang |
3rd Author's Affiliation | Department of Electronics Engineering & Institute of Electronics, National Cbiao-Tung University |
4th Author's Name | Yuan-Tung Dai |
4th Author's Affiliation | Electronics Research & Service Organization of Industrial Technology Research Institute |
Date | 2002/6/24 |
Paper # | ED2002-152 |
Volume (vol) | vol.102 |
Number (no) | 175 |
Page | pp.pp.- |
#Pages | 4 |
Date of Issue |