Presentation 2002/6/24
Formation of Ultra-thin Silicon Dioxide Films at Low Temperatures using Remote Plasma Oxidation and Application for Gate Insulators
Y.H. Sun, T. Iida, T. Kimoto, H. Matsunami,
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Abstract(in English) SiO_2 films have been formed directly on a silicon surface by remote plasma oxidation at low temperatures (500~680℃). We have investigated the electrical properties and Si/SiO_2 interface properties using a quasi-static C-V method. The breakdown electric field exceeded 10 MV/cm. The Si/SiO_2 interface state density and the fixed charge density could be reduced with increasing oxidation temperature. MOSFETs with plasma-oxidized SiO_2 exhibited an effective channel mobility of 350 cm^2/Vs. The interface properties were also characterized by using MOSFETs as gate controlled diodes.
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Keyword(in English) plasma oxidation / quasi-static C-V / MOSFET / gate-controlled diode
Paper # ED2002-149
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Committee ED
Conference Date 2002/6/24(1days)
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Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Formation of Ultra-thin Silicon Dioxide Films at Low Temperatures using Remote Plasma Oxidation and Application for Gate Insulators
Sub Title (in English)
Keyword(1) plasma oxidation
Keyword(2) quasi-static C-V
Keyword(3) MOSFET
Keyword(4) gate-controlled diode
1st Author's Name Y.H. Sun
1st Author's Affiliation Department of Electronic Science and Engineering, Kyoto University()
2nd Author's Name T. Iida
2nd Author's Affiliation Department of Electronic Science and Engineering, Kyoto University
3rd Author's Name T. Kimoto
3rd Author's Affiliation Department of Electronic Science and Engineering, Kyoto University
4th Author's Name H. Matsunami
4th Author's Affiliation Department of Electronic Science and Engineering, Kyoto University
Date 2002/6/24
Paper # ED2002-149
Volume (vol) vol.102
Number (no) 175
Page pp.pp.-
#Pages 5
Date of Issue