Presentation 2002/6/24
Preparation of HfO_2 thin films by chemical vapor deposition for gate-insulator applications
Makoto NAKAYAMA, Kenji TAKAHASHI, Hiroshi FUNAKUBO, Eisuke TOKUMITSU,
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Abstract(in English) HfO_2 thin films were deposited on p-type Si (100) substrates by the chemical vapor deposition technique using Hf(O_<-t>C_4H_9)_4 as a source material. Capacitance-voltage (C-V) characteristics of Al/HfO_2/SiO_2/Si/Ag structures had little hysteresis and an SiO_2 equivalent oxide thickness (EOT) of 1.8nm was obtained for the sample with a physical HfO_2 thickness of 2.5 nm. HRTEM image shows the presence of 1 .4 nm interfacial layer. The relative dielectric constant ε_r of the HfO_2 layer and the thickness of the interfacial layer, estimated from the EOT plot as a function of HfO_2 physical thickness, are 19.7 and 1.4nm, respectively.
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Keyword(in English) CVD / HfO_2 / High-k / gate-insulator / HTB
Paper # ED2002-147
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Committee ED
Conference Date 2002/6/24(1days)
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Registration To Electron Devices (ED)
Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Preparation of HfO_2 thin films by chemical vapor deposition for gate-insulator applications
Sub Title (in English)
Keyword(1) CVD
Keyword(2) HfO_2
Keyword(3) High-k
Keyword(4) gate-insulator
Keyword(5) HTB
1st Author's Name Makoto NAKAYAMA
1st Author's Affiliation P&I Lab , Tokyo Institute of Technology()
2nd Author's Name Kenji TAKAHASHI
2nd Author's Affiliation Dep. Innov. Eng. Mater , Tokyo Institute of Technology
3rd Author's Name Hiroshi FUNAKUBO
3rd Author's Affiliation Dep. Innov. Eng. Mater , Tokyo Institute of Technology
4th Author's Name Eisuke TOKUMITSU
4th Author's Affiliation Res. Inst. Electrical Communication, Tohoku Univ.
Date 2002/6/24
Paper # ED2002-147
Volume (vol) vol.102
Number (no) 175
Page pp.pp.-
#Pages 5
Date of Issue