| Presentation | 2002/6/24 Formation of Ti-capped NiSi and its Barrier Properties against Cu Diffusion Soo-Jin Park, Keun-Woo Lee, Ju-Youn Kim, Kyoo-Sik Bae, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | The formation of NiSi with the Ti capping layer to improve the thermal stability and the feasibility for utilizing this Ti-capping layer as a barrier against Cu diffusion were investigated. It was found that the Ti capping layer suppressed the Ni diffusion, and thus the agglomeration of NiSi films and the formation of NiSi_2 phase, leading to the better thermal stability. Furthermore, the Ti-capping or TiN layer inhibited the Cu diffusion. However, NiSi dissociated due to the presence of Cu and then Ni diffused into the Cu layer. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | NiSi / Ti Capping Layer / Thermal Stability / Cu Diffusion Barrier |
| Paper # | ED2002-142 |
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| Conference Information | |
| Committee | ED |
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| Conference Date | 2002/6/24(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
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| Vice Chair | |
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| Paper Information | |
| Registration To | Electron Devices (ED) |
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| Language | ENG |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Formation of Ti-capped NiSi and its Barrier Properties against Cu Diffusion |
| Sub Title (in English) | |
| Keyword(1) | NiSi |
| Keyword(2) | Ti Capping Layer |
| Keyword(3) | Thermal Stability |
| Keyword(4) | Cu Diffusion Barrier |
| 1st Author's Name | Soo-Jin Park |
| 1st Author's Affiliation | Department of Electronic Materials Engineering, The University of Suwon() |
| 2nd Author's Name | Keun-Woo Lee |
| 2nd Author's Affiliation | Department of Electronic Materials Engineering, The University of Suwon |
| 3rd Author's Name | Ju-Youn Kim |
| 3rd Author's Affiliation | Department of Materials Engineering, Hanyang University |
| 4th Author's Name | Kyoo-Sik Bae |
| 4th Author's Affiliation | Department of Electronic Materials Engineering, The University of Suwon |
| Date | 2002/6/24 |
| Paper # | ED2002-142 |
| Volume (vol) | vol.102 |
| Number (no) | 175 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |