Presentation 2002/6/24
Formation of [111] Preferentially Oriented Cu Layer on [110] Nb Barrier on SiO_2
Md. MANIRUZZAMAN, Mayumi B. TAKEYAMA, Atsushi NOYA,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) The [111] oriented Cu layer, which was attracted much attention as an interconnect layer of excellent electronmigration resistance, was obtained on the [110] oriented Nb barrier formed on the thermally grown SiO_2 layer. The rocking curves measured by X-ray diffraction revealed the full width at half maximum (FWHM) values of 6.0° and 3.0° for asdeposited [110] Nb and [111] Cu layers, respectively, which was a good measure of the mosaicity in the prepared thin film assembly. This result suggested that the [111] oriented Cu layer of good quality was obtained on amorphous SiO_2 by using the buffer layer of [110] oriented Nb as a diffusion barrier. The model system of Cu/Nb/SiO_2/Si was thermally stable without excess solid-phase reaction and/or diffusion upon annealing at temperatures up to 500℃ or higher.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) metallization / diffusion barrier / preferred orientation / copper / niobium
Paper # ED2002-140
Date of Issue

Conference Information
Committee ED
Conference Date 2002/6/24(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To Electron Devices (ED)
Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Formation of [111] Preferentially Oriented Cu Layer on [110] Nb Barrier on SiO_2
Sub Title (in English)
Keyword(1) metallization
Keyword(2) diffusion barrier
Keyword(3) preferred orientation
Keyword(4) copper
Keyword(5) niobium
1st Author's Name Md. MANIRUZZAMAN
1st Author's Affiliation Department of Electrical and Electronic Engineering, Faculty of Engineering, Kitami Institute of Technology()
2nd Author's Name Mayumi B. TAKEYAMA
2nd Author's Affiliation Department of Electrical and Electronic Engineering, Faculty of Engineering, Kitami Institute of Technology
3rd Author's Name Atsushi NOYA
3rd Author's Affiliation Department of Electrical and Electronic Engineering, Faculty of Engineering, Kitami Institute of Technology
Date 2002/6/24
Paper # ED2002-140
Volume (vol) vol.102
Number (no) 175
Page pp.pp.-
#Pages 4
Date of Issue