Presentation 2002/6/24
FEOL Process for Sub-100nm DRAM
Gyoyoung Jin, Siyoung Choi, Jinhwa Heo,
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Abstract(in English) Key technologies in front end of line (FEOL) process of DRAM for sub-100nm node generation are reviewed.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) DRAM / shallow trench isolation / tungsten gate / cobalt silicide
Paper # ED2002-116
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Committee ED
Conference Date 2002/6/24(1days)
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Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) FEOL Process for Sub-100nm DRAM
Sub Title (in English)
Keyword(1) DRAM
Keyword(2) shallow trench isolation
Keyword(3) tungsten gate
Keyword(4) cobalt silicide
1st Author's Name Gyoyoung Jin
1st Author's Affiliation DRAM PA()
2nd Author's Name Siyoung Choi
2nd Author's Affiliation Process Development Team,Semiconductor R&D Center Memory Division, Samsung Electronics Co.
3rd Author's Name Jinhwa Heo
3rd Author's Affiliation Process Development Team,Semiconductor R&D Center Memory Division, Samsung Electronics Co.
Date 2002/6/24
Paper # ED2002-116
Volume (vol) vol.102
Number (no) 175
Page pp.pp.-
#Pages 4
Date of Issue