Presentation | 2002/6/24 FEOL Process for Sub-100nm DRAM Gyoyoung Jin, Siyoung Choi, Jinhwa Heo, |
---|---|
PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | Key technologies in front end of line (FEOL) process of DRAM for sub-100nm node generation are reviewed. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | DRAM / shallow trench isolation / tungsten gate / cobalt silicide |
Paper # | ED2002-116 |
Date of Issue |
Conference Information | |
Committee | ED |
---|---|
Conference Date | 2002/6/24(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | |
Chair | |
Vice Chair | |
Secretary | |
Assistant |
Paper Information | |
Registration To | Electron Devices (ED) |
---|---|
Language | ENG |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | FEOL Process for Sub-100nm DRAM |
Sub Title (in English) | |
Keyword(1) | DRAM |
Keyword(2) | shallow trench isolation |
Keyword(3) | tungsten gate |
Keyword(4) | cobalt silicide |
1st Author's Name | Gyoyoung Jin |
1st Author's Affiliation | DRAM PA() |
2nd Author's Name | Siyoung Choi |
2nd Author's Affiliation | Process Development Team,Semiconductor R&D Center Memory Division, Samsung Electronics Co. |
3rd Author's Name | Jinhwa Heo |
3rd Author's Affiliation | Process Development Team,Semiconductor R&D Center Memory Division, Samsung Electronics Co. |
Date | 2002/6/24 |
Paper # | ED2002-116 |
Volume (vol) | vol.102 |
Number (no) | 175 |
Page | pp.pp.- |
#Pages | 4 |
Date of Issue |