Presentation 2005/10/6
Characteristics of AlGaN/GaN HEMT on (111) Silicon Substrates
Yoshiaki KATAYAMA, Hiroyasu ISHIKAWA, Takashi EGAWA,
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Abstract(in English) AlGaN/GaN HEMTs were fabricated on Si and Sapphire substrates inorder to study the thermal conductivity of the substrates. The HEMT devices fabricated on Silicon substrate show superior device characteristics than those on the Sapphire substrates. For example the Si substrate samples have high thermal conductivity, cheap manufacturing possible for large size substrates. Further it is easy to fabricate HEMT device and reduce the thickness of the Si substrate whereas thinning the Sapphire substrate is very difficult. This study was conducted with the primary aim of measuring the temperature dependent conductivity of the substrates namely silicon and Sapphire.
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Keyword(in English) GaN / HEMT / Thermal conductivity / Si
Paper # ED2005-131,CPM2005-118,LQE005-58
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Committee ED
Conference Date 2005/10/6(1days)
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Registration To Electron Devices (ED)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Characteristics of AlGaN/GaN HEMT on (111) Silicon Substrates
Sub Title (in English)
Keyword(1) GaN
Keyword(2) HEMT
Keyword(3) Thermal conductivity
Keyword(4) Si
1st Author's Name Yoshiaki KATAYAMA
1st Author's Affiliation Nagoya Institute of Technology()
2nd Author's Name Hiroyasu ISHIKAWA
2nd Author's Affiliation Research Center for Micro-Structure Devices, Nagoya Institute of Technology
3rd Author's Name Takashi EGAWA
3rd Author's Affiliation Research Center for Micro-Structure Devices, Nagoya Institute of Technology
Date 2005/10/6
Paper # ED2005-131,CPM2005-118,LQE005-58
Volume (vol) vol.105
Number (no) 325
Page pp.pp.-
#Pages 4
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