Presentation 2005-10-21
Thermal Analysis on Microprocessors
Naoyuki HASEGAWA, MUTSUO Ito, Ryusuke EGAWA, Kenichi SUZUKI, Tadao NAKAMURA,
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Abstract(in English) Recently, the advance in the semiconductor process technology and the modern microarchitectural techniques have enabled microprocessors to obtain higher performance continuously. However, as a result of the radical improvement, in turn, inevitable high temperature induced by the circuits restricts the performance and reliability. Consequently, it is very important to analyze on-chip temperature distribution and apply the results of it to the design. Conventionally, most of the existing thermal analyzing methods regard a functional block as a heat source due to focusing on early design stages. It has a difficulty in comprehending and making use of the thermal behavior on later design stages. In our study, we propose a fine-grain thermal analysis method modeling a logic gate as a unit of a heat source. This paper shows quantitative evaluations of the effect of the fine-grain heat source model, and discusses the effectiveness of our proposal.
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Keyword(in English) Thermal Analysis / Cell Level / Hotspot
Paper # SIP2005-117,ICD2005-136,IE2005-81
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Conference Date 2005/10/14(1days)
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Registration To Integrated Circuits and Devices (ICD)
Language JPN
Title (in Japanese) (See Japanese page)
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Title (in English) Thermal Analysis on Microprocessors
Sub Title (in English)
Keyword(1) Thermal Analysis
Keyword(2) Cell Level
Keyword(3) Hotspot
1st Author's Name Naoyuki HASEGAWA
1st Author's Affiliation Graduate School of Information Sciences, Tohoku University()
2nd Author's Name MUTSUO Ito
2nd Author's Affiliation Graduate School of Information Sciences, Tohoku University
3rd Author's Name Ryusuke EGAWA
3rd Author's Affiliation Graduate School of Information Sciences, Tohoku University
4th Author's Name Kenichi SUZUKI
4th Author's Affiliation Graduate School of Information Sciences, Tohoku University
5th Author's Name Tadao NAKAMURA
5th Author's Affiliation Graduate School of Information Sciences, Tohoku University
Date 2005-10-21
Paper # SIP2005-117,ICD2005-136,IE2005-81
Volume (vol) vol.105
Number (no) 352
Page pp.pp.-
#Pages 6
Date of Issue