Presentation 2002/8/15
An Embedded DRAM Technology with SOI/Bulk Hybrid Substrate for High-End SoC Application
Takashi YAMADA, Kazumi TAKAHASHI, Hisato OYAMATSU, Hajime NAGANO, Tsutomu SATO, Ichiro MIZUSHIMA, Shinichi NITTA, Takehiko HOJI, Koichi KOKUBUN, Kaori YASUMOTO, Yoshinori MATSUBARA, Takeshi YOSHIDA, Seiji YAMADA, Yoshitaka TSUNASHIMA, Yoshihiko SAITO, Souichi NADAHARA, Yasuhiro KATSUMATA, Makoto YOSHIMI, Hidemi ISHIUCHI,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) A new methodology to form highly accomplished SOI/Bulk hybrid wafers with conventional in-line processes is proposed. Since the SOI/Bulk hybrid wafer has both SOI (Silicon On Insulator) substrate regions and bulk Si substrate regions, bulk devices such as DRAM cells can be embedded with high-performance SOI logic in the wafer. The structure of the hybrid wafer was achieved by etching part of the SOI/BOX (Buried Oxide) layers on SOI wafer and growing Si on the exposed Si base substrate with conventional SEG (Selective Epitaxial Growth) process. The electrical characteristics of DRAMs embedded in the hybrid wafer matched those of DRAMs produced on bulk wafer with 180 nm CMOS process technology. The highly manufacturable SOI embedded DRAM technology is attractive for high-end SoC (System on Chip) solution.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) SOI / DRAM / embedded DRAM / SEG / SoC
Paper # SDM2002-143
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Conference Information
Committee SDM
Conference Date 2002/8/15(1days)
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Paper Information
Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) An Embedded DRAM Technology with SOI/Bulk Hybrid Substrate for High-End SoC Application
Sub Title (in English)
Keyword(1) SOI
Keyword(2) DRAM
Keyword(3) embedded DRAM
Keyword(4) SEG
Keyword(5) SoC
1st Author's Name Takashi YAMADA
1st Author's Affiliation Semiconductor Company, Toshiba Corporation()
2nd Author's Name Kazumi TAKAHASHI
2nd Author's Affiliation Toshiba Microelectronics Corporation
3rd Author's Name Hisato OYAMATSU
3rd Author's Affiliation Semiconductor Company, Toshiba Corporation
4th Author's Name Hajime NAGANO
4th Author's Affiliation Semiconductor Company, Toshiba Corporation
5th Author's Name Tsutomu SATO
5th Author's Affiliation Semiconductor Company, Toshiba Corporation
6th Author's Name Ichiro MIZUSHIMA
6th Author's Affiliation Semiconductor Company, Toshiba Corporation
7th Author's Name Shinichi NITTA
7th Author's Affiliation Semiconductor Company, Toshiba Corporation
8th Author's Name Takehiko HOJI
8th Author's Affiliation Semiconductor Company, Toshiba Corporation
9th Author's Name Koichi KOKUBUN
9th Author's Affiliation Semiconductor Company, Toshiba Corporation
10th Author's Name Kaori YASUMOTO
10th Author's Affiliation Semiconductor Company, Toshiba Corporation
11th Author's Name Yoshinori MATSUBARA
11th Author's Affiliation Semiconductor Company, Toshiba Corporation
12th Author's Name Takeshi YOSHIDA
12th Author's Affiliation Semiconductor Company, Toshiba Corporation
13th Author's Name Seiji YAMADA
13th Author's Affiliation Semiconductor Company, Toshiba Corporation
14th Author's Name Yoshitaka TSUNASHIMA
14th Author's Affiliation Semiconductor Company, Toshiba Corporation
15th Author's Name Yoshihiko SAITO
15th Author's Affiliation Semiconductor Company, Toshiba Corporation
16th Author's Name Souichi NADAHARA
16th Author's Affiliation Semiconductor Company, Toshiba Corporation
17th Author's Name Yasuhiro KATSUMATA
17th Author's Affiliation Semiconductor Company, Toshiba Corporation
18th Author's Name Makoto YOSHIMI
18th Author's Affiliation Semiconductor Company, Toshiba Corporation
19th Author's Name Hidemi ISHIUCHI
19th Author's Affiliation Semiconductor Company, Toshiba Corporation
Date 2002/8/15
Paper # SDM2002-143
Volume (vol) vol.102
Number (no) 271
Page pp.pp.-
#Pages 5
Date of Issue