Presentation 2002/8/23
Quantitative analysis of surface and interface of SOI by Kelvin-Surface Photovoltage method
Daisuke WATANABE, Aimin EN, Seiji NAKAMURA, Michihiko SUHARA, Tsugunoui OKUMURA,
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Abstract(in English) Electronic properties of the surface and interface of the SOI wafers as well as the surface of the Si wafers have been characterized by the Kelvin method combined with Surface-Photovoltage (SPV) method. With the use of 340nm UV light source, -0.4[V] of SPV was detected at 1 [mA/cm^2] of the photocurrent density for the 4.5% HF treated p-Si(100) surface. This result indicates that there is anomalously large surface band-bending at the HF-treated p-Si (100) surface. In addition, it is noted that the conductivity type of the p-Si surface region is inverted. On the other hand, very weak SPV with the value of 60[mV] was observed for the HF-treated n-Si(100) surface. These results indicate that the Fermi level position at the surface is pinned in the vicinity of the bottom of the conduction band. Furthermore, the interface recombination rate for the SOI/BOX interface was estimated from the result of the temperature dependence of the contactless I-V characteristics for the SOI wafer.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) SOI / Kelvin-Surface Photoveltage method / H-terminated surface / surface band-bending
Paper # ED2002-196
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Committee ED
Conference Date 2002/8/23(1days)
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Registration To Electron Devices (ED)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Quantitative analysis of surface and interface of SOI by Kelvin-Surface Photovoltage method
Sub Title (in English)
Keyword(1) SOI
Keyword(2) Kelvin-Surface Photoveltage method
Keyword(3) H-terminated surface
Keyword(4) surface band-bending
1st Author's Name Daisuke WATANABE
1st Author's Affiliation Department of Electrical Engineering, Graduate School of Engineering, Tokyo Metropolitan University.()
2nd Author's Name Aimin EN
2nd Author's Affiliation Department of Electrical Engineering, Graduate School of Engineering, Tokyo Metropolitan University.
3rd Author's Name Seiji NAKAMURA
3rd Author's Affiliation Department of Electrical Engineering, Graduate School of Engineering, Tokyo Metropolitan University.
4th Author's Name Michihiko SUHARA
4th Author's Affiliation Department of Electrical Engineering, Graduate School of Engineering, Tokyo Metropolitan University.
5th Author's Name Tsugunoui OKUMURA
5th Author's Affiliation Department of Electrical Engineering, Graduate School of Engineering, Tokyo Metropolitan University.
Date 2002/8/23
Paper # ED2002-196
Volume (vol) vol.102
Number (no) 294
Page pp.pp.-
#Pages 6
Date of Issue