Presentation 1999/9/28
Electric Characteristics of Gate Dielectrics formed by using an RTA
H. Umeda, A. Teramoto, Y. Ohno, A. Shigetomi,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We have developed and evaluated gate dielectric films formed in some kinds of gas ambient by using an RTA (Rapid Thermal Annealer). It has been found that dielectric films formed in a hydrogen/oxygen (wet) and an nitrous oxide by using an RTA show higher reliability than those formed by using a conventional furnace. And, it has been found that an oxidation in a dry oxygen ambient under ultraviolet irradiation (UV-O_2 oxidation) by using an RTA, not only show high reliability, but also provide low-temperature processing. It is thought to be important that activated oxidants can reach to Si substrates within there life-time for forming those highly reliable gate dielectric films.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) RTA / wet oxide / N_2O oxynitride / ultraviolet rays / TDDB / activated oxidant
Paper # SDM99-153
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Committee SDM
Conference Date 1999/9/28(1days)
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Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Electric Characteristics of Gate Dielectrics formed by using an RTA
Sub Title (in English)
Keyword(1) RTA
Keyword(2) wet oxide
Keyword(3) N_2O oxynitride
Keyword(4) ultraviolet rays
Keyword(5) TDDB
Keyword(6) activated oxidant
1st Author's Name H. Umeda
1st Author's Affiliation Mitsubishi Electric Corporation, ULSI Development Center()
2nd Author's Name A. Teramoto
2nd Author's Affiliation Mitsubishi Electric Corporation, ULSI Development Center
3rd Author's Name Y. Ohno
3rd Author's Affiliation Mitsubishi Electric Corporation, ULSI Development Center
4th Author's Name A. Shigetomi
4th Author's Affiliation Mitsubishi Electric Corporation, ULSI Development Center
Date 1999/9/28
Paper # SDM99-153
Volume (vol) vol.99
Number (no) 340
Page pp.pp.-
#Pages 6
Date of Issue