Presentation 1999/11/19
Backside Electron Beam Testing Method for Flip Chip
Eiji Yoshida, Taichi Nakashima, Tohru Koyama, Junko Komori, Yoji Mashiko,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We propose a new technique for analyzing flip chip using backside electron beam (EB) testing method. We have developed new sample preparation method from the backside of the flip chip for the EB testing, and have succeeded to expose observation metal-lines in short time and at high location accuracy. As a result, for pseudo-failure we have acquired voltage contrast image and voltage waveform as same as the EB testing from front-side, and have confirmed that the backside EB testing method is useful for failure analysis of the flip chip.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Electron Beam Testing / Backside Analysis / Flip Chip / Fault Dictionary / Dicing Saw / Focused Ion Beam
Paper # R99-23
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Committee R
Conference Date 1999/11/19(1days)
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Registration To Reliability(R)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Backside Electron Beam Testing Method for Flip Chip
Sub Title (in English)
Keyword(1) Electron Beam Testing
Keyword(2) Backside Analysis
Keyword(3) Flip Chip
Keyword(4) Fault Dictionary
Keyword(5) Dicing Saw
Keyword(6) Focused Ion Beam
1st Author's Name Eiji Yoshida
1st Author's Affiliation Mitsubishi Electric Corporation()
2nd Author's Name Taichi Nakashima
2nd Author's Affiliation Ryoden Semiconductor System Engineering Corp.
3rd Author's Name Tohru Koyama
3rd Author's Affiliation Mitsubishi Electric Corporation
4th Author's Name Junko Komori
4th Author's Affiliation Mitsubishi Electric Corporation
5th Author's Name Yoji Mashiko
5th Author's Affiliation Mitsubishi Electric Corporation
Date 1999/11/19
Paper # R99-23
Volume (vol) vol.99
Number (no) 454
Page pp.pp.-
#Pages 6
Date of Issue