Presentation 1999/11/18
Surface Mountable Ceramic Package for Millimeter-wave Module
Shinichi Koriyama, Kenji Kitazawa, Naoyuki Shino, Hidehiro Minamiue,
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Abstract(in English) A new ceramic package for millimeter-wave module has been developed. The package has a vertical transition structure of electromagnetic coupling and optimized terminal structure for surface mount assembly. We confirmed that the surface mounted package shows high transmission characteristics and reliability.
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Keyword(in English) millimeter-wave / package / surface mount / electromagnetic / coupling / assembly / interconnection
Paper # MW99-146
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Committee MW
Conference Date 1999/11/18(1days)
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Registration To Microwaves (MW)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Surface Mountable Ceramic Package for Millimeter-wave Module
Sub Title (in English)
Keyword(1) millimeter-wave
Keyword(2) package
Keyword(3) surface mount
Keyword(4) electromagnetic
Keyword(5) coupling
Keyword(6) assembly
Keyword(7) interconnection
1st Author's Name Shinichi Koriyama
1st Author's Affiliation R&D Center Kagoshima, Kyocera Corporation()
2nd Author's Name Kenji Kitazawa
2nd Author's Affiliation R&D Center Kagoshima, Kyocera Corporation
3rd Author's Name Naoyuki Shino
3rd Author's Affiliation R&D Center Kagoshima, Kyocera Corporation
4th Author's Name Hidehiro Minamiue
4th Author's Affiliation R&D Center Kagoshima, Kyocera Corporation
Date 1999/11/18
Paper # MW99-146
Volume (vol) vol.99
Number (no) 442
Page pp.pp.-
#Pages 8
Date of Issue