| Presentation | 1999/12/3 Advantage of silver plating on PCB for CSP/BGA assembly : Improvement of connection reliability for special kind of silver plating on PCB. Satoru Saito, John Baker, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Now many assembly makers useing nickel/gold plating printed circuit board for BGA/CSP applications. But nickel/gold plating has poor performance for BGA/CSP assembly. And Historical disadvantages of silver plating were migration, unstable solutions and readily forms black sulphides. We developed and overcame this kind of problem by using immersion organo-metallic silver technology. The technology can replace nickel/gold plating for BGA/CSP applications. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | silver plating / organo-metallic layer / BGA / CSP / Ni/Au plating / flat surface |
| Paper # | CPM99-133 |
| Date of Issue |
| Conference Information | |
| Committee | CPM |
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| Conference Date | 1999/12/3(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Advantage of silver plating on PCB for CSP/BGA assembly : Improvement of connection reliability for special kind of silver plating on PCB. |
| Sub Title (in English) | |
| Keyword(1) | silver plating |
| Keyword(2) | organo-metallic layer |
| Keyword(3) | BGA |
| Keyword(4) | CSP |
| Keyword(5) | Ni/Au plating |
| Keyword(6) | flat surface |
| 1st Author's Name | Satoru Saito |
| 1st Author's Affiliation | Cookson ELECTRONICS PC fabrication() |
| 2nd Author's Name | John Baker |
| 2nd Author's Affiliation | Cookson ELECTRONICS PC fabrication |
| Date | 1999/12/3 |
| Paper # | CPM99-133 |
| Volume (vol) | vol.99 |
| Number (no) | 484 |
| Page | pp.pp.- |
| #Pages | 5 |
| Date of Issue | |