Presentation 1999/10/29
Design and Fabrication of Chip-to-Chip Single Flux Quantum Transfer Circuits
Masaaki Maezawa, Hirotake Yamamori, Akira Shoji,
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Abstract(in English) We have designed, fabricated and successfully tested a chip-to-chip single flux quantum transfer circuit. We have used an active multi-chip module (MCM) technique in which Josephson junctions are integrated on a MCM substrate as well as on a chip. The circuit has been fabricated using a standard Nb technology and a solder-bumped flip-chip bonding technology. Testing has been carried out at low speed. Measured margins for the global factor for bias currents have been as large as +/-37%.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) multi-chip module / MCM / flip-chip bonding / RSFQ / Josephson junction
Paper # SCE99-36
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Conference Information
Committee SCE
Conference Date 1999/10/29(1days)
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Registration To Superconductive Electronics (SCE)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Design and Fabrication of Chip-to-Chip Single Flux Quantum Transfer Circuits
Sub Title (in English)
Keyword(1) multi-chip module
Keyword(2) MCM
Keyword(3) flip-chip bonding
Keyword(4) RSFQ
Keyword(5) Josephson junction
1st Author's Name Masaaki Maezawa
1st Author's Affiliation Electron Devices Division, Electrotechnical Laboratory()
2nd Author's Name Hirotake Yamamori
2nd Author's Affiliation Electron Devices Division, Electrotechnical Laboratory
3rd Author's Name Akira Shoji
3rd Author's Affiliation Electron Devices Division, Electrotechnical Laboratory
Date 1999/10/29
Paper # SCE99-36
Volume (vol) vol.99
Number (no) 408
Page pp.pp.-
#Pages 6
Date of Issue