Presentation | 1999/10/29 Design and Fabrication of Chip-to-Chip Single Flux Quantum Transfer Circuits Masaaki Maezawa, Hirotake Yamamori, Akira Shoji, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | We have designed, fabricated and successfully tested a chip-to-chip single flux quantum transfer circuit. We have used an active multi-chip module (MCM) technique in which Josephson junctions are integrated on a MCM substrate as well as on a chip. The circuit has been fabricated using a standard Nb technology and a solder-bumped flip-chip bonding technology. Testing has been carried out at low speed. Measured margins for the global factor for bias currents have been as large as +/-37%. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | multi-chip module / MCM / flip-chip bonding / RSFQ / Josephson junction |
Paper # | SCE99-36 |
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Committee | SCE |
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Conference Date | 1999/10/29(1days) |
Place (in Japanese) | (See Japanese page) |
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Topics (in Japanese) | (See Japanese page) |
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Paper Information | |
Registration To | Superconductive Electronics (SCE) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Design and Fabrication of Chip-to-Chip Single Flux Quantum Transfer Circuits |
Sub Title (in English) | |
Keyword(1) | multi-chip module |
Keyword(2) | MCM |
Keyword(3) | flip-chip bonding |
Keyword(4) | RSFQ |
Keyword(5) | Josephson junction |
1st Author's Name | Masaaki Maezawa |
1st Author's Affiliation | Electron Devices Division, Electrotechnical Laboratory() |
2nd Author's Name | Hirotake Yamamori |
2nd Author's Affiliation | Electron Devices Division, Electrotechnical Laboratory |
3rd Author's Name | Akira Shoji |
3rd Author's Affiliation | Electron Devices Division, Electrotechnical Laboratory |
Date | 1999/10/29 |
Paper # | SCE99-36 |
Volume (vol) | vol.99 |
Number (no) | 408 |
Page | pp.pp.- |
#Pages | 6 |
Date of Issue |