Presentation 2002/8/23
Optical MCM technology for 3D LSI
Tomonori NAKAMURA, Toru HASHIMOTO, Jeoung Chill SHIM, Hiroyuki KURINO, Mitsumasa KOYANAGI,
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Abstract(in English) In order to overcome wiring problem in future electric system, we proposed a new optical interconnection technology for a multi chip module system assembled from three dimensional LSI's. In this multi chip module, 3D LSI's with VCSEL's are mounted on the optical plate which transfer the optical signal between 3D LSI's through polyimide optical wave guides. We have developed the three dimensional integration technology and optical interconnection technology to realize the optical MCM. In this paper, we mainly presented the fabrication process for the optical MCM and basic evaluation results of optical interconnection.
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Keyword(in English) three dimensional LSI / Optical interconnection / wave guide / VCSEL / Optical MCM / IO bottleneck
Paper # LQE2002-117
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Committee LQE
Conference Date 2002/8/23(1days)
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Registration To Lasers and Quantum Electronics (LQE)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Optical MCM technology for 3D LSI
Sub Title (in English)
Keyword(1) three dimensional LSI
Keyword(2) Optical interconnection
Keyword(3) wave guide
Keyword(4) VCSEL
Keyword(5) Optical MCM
Keyword(6) IO bottleneck
1st Author's Name Tomonori NAKAMURA
1st Author's Affiliation Dept. of Machine Intelligence and Systems Engineering, Tohoku University()
2nd Author's Name Toru HASHIMOTO
2nd Author's Affiliation Dept. of Machine Intelligence and Systems Engineering, Tohoku University
3rd Author's Name Jeoung Chill SHIM
3rd Author's Affiliation Dept. of Machine Intelligence and Systems Engineering, Tohoku University
4th Author's Name Hiroyuki KURINO
4th Author's Affiliation Dept. of Machine Intelligence and Systems Engineering, Tohoku University
5th Author's Name Mitsumasa KOYANAGI
5th Author's Affiliation Dept. of Machine Intelligence and Systems Engineering, Tohoku University
Date 2002/8/23
Paper # LQE2002-117
Volume (vol) vol.102
Number (no) 290
Page pp.pp.-
#Pages 6
Date of Issue