Presentation 2002/8/23
40Gbit/s Optical Modules using the flip-chip bonding
Toshiharu Miyahara, Norio Okada, Masaki Noda, Yasunori Miyazaki, Eitaro Ishimura, Mitsunori Ishizaki, Tatsuo Hatta,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We have developed PD preamp modules and EA modulator modules for 40Gbit/s optical communication systems. Using the flip-chip bonding technique to reduce the characteristic degradation caused by the parasitic inductance at high frequency, good electrical and optical characteristics were demonstrated.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) flip-chip / 40Gbit/s / optical module / optical communication
Paper # OPE2002-63
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Committee OPE
Conference Date 2002/8/23(1days)
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Registration To Optoelectronics (OPE)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) 40Gbit/s Optical Modules using the flip-chip bonding
Sub Title (in English)
Keyword(1) flip-chip
Keyword(2) 40Gbit/s
Keyword(3) optical module
Keyword(4) optical communication
1st Author's Name Toshiharu Miyahara
1st Author's Affiliation Mitsubishi Electric Corporation()
2nd Author's Name Norio Okada
2nd Author's Affiliation Mitsubishi Electric Corporation
3rd Author's Name Masaki Noda
3rd Author's Affiliation Mitsubishi Electric Corporation
4th Author's Name Yasunori Miyazaki
4th Author's Affiliation Mitsubishi Electric Corporation
5th Author's Name Eitaro Ishimura
5th Author's Affiliation Mitsubishi Electric Corporation
6th Author's Name Mitsunori Ishizaki
6th Author's Affiliation Mitsubishi Electric Corporation
7th Author's Name Tatsuo Hatta
7th Author's Affiliation Mitsubishi Electric Corporation
Date 2002/8/23
Paper # OPE2002-63
Volume (vol) vol.102
Number (no) 288
Page pp.pp.-
#Pages 6
Date of Issue