Presentation 2002/8/23
Low-Cost Opto-Electronic Packaging Technology for High-Speed IT Appliances
Osamu IBARAGI, Seiji KARASHIMA, Akira ICHIMURA, Naohiro HIROSE, Yutaka OKABE, Kouich KUMAI, Takashi MIKAWA,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) R&D efforts of low-cost opto-electronic packaging technology for high-speed IT appliances were reported. The alignment accuracy of optical-waveguide film laminating technology was achieved to ±6 μm, and the applicability for low-cost OE-MCM was verified. The AIP models of 3D-construction with LD, PD and interface ICs had the performance of 3Gbps transmission. The expectation for high-performance of Thps class was demonstrated by subrack model using optical fiber boards and fiber right-angled connectors. Self-Written Waveguide technology was developed for easy optical fiber coupling. Ultra compact optical multi/demultiplexer, which was composed of MT-ferrule, micro lenses and dielectric filters, was developed for C-WDM.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Opto-Electronic Packaging / OE-MCM / Active Interposer / Optical Multi/Demultiplexer / Optical Fiber Board / Self-Written Waveguide
Paper # OPE2002-59
Date of Issue

Conference Information
Committee OPE
Conference Date 2002/8/23(1days)
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Paper Information
Registration To Optoelectronics (OPE)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Low-Cost Opto-Electronic Packaging Technology for High-Speed IT Appliances
Sub Title (in English)
Keyword(1) Opto-Electronic Packaging
Keyword(2) OE-MCM
Keyword(3) Active Interposer
Keyword(4) Optical Multi/Demultiplexer
Keyword(5) Optical Fiber Board
Keyword(6) Self-Written Waveguide
1st Author's Name Osamu IBARAGI
1st Author's Affiliation Musashino Research Center, Electronic System Integration Department, Association of Super-Advanced Electronics Technologies (ASET)()
2nd Author's Name Seiji KARASHIMA
2nd Author's Affiliation Musashino Research Center, Electronic System Integration Department, Association of Super-Advanced Electronics Technologies (ASET)
3rd Author's Name Akira ICHIMURA
3rd Author's Affiliation Musashino Research Center, Electronic System Integration Department, Association of Super-Advanced Electronics Technologies (ASET)
4th Author's Name Naohiro HIROSE
4th Author's Affiliation Musashino Research Center, Electronic System Integration Department, Association of Super-Advanced Electronics Technologies (ASET)
5th Author's Name Yutaka OKABE
5th Author's Affiliation Musashino Research Center, Electronic System Integration Department, Association of Super-Advanced Electronics Technologies (ASET)
6th Author's Name Kouich KUMAI
6th Author's Affiliation Musashino Research Center, Electronic System Integration Department, Association of Super-Advanced Electronics Technologies (ASET)
7th Author's Name Takashi MIKAWA
7th Author's Affiliation Musashino Research Center, Electronic System Integration Department, Association of Super-Advanced Electronics Technologies (ASET)
Date 2002/8/23
Paper # OPE2002-59
Volume (vol) vol.102
Number (no) 288
Page pp.pp.-
#Pages 6
Date of Issue