| Presentation | 2004-10-21 低電圧デバイスの高速・高密度実装の現状 : 微細化技術(低電圧化・高集積化)によって、顕在化したハード(ボード)設計の課題とその解決案(プロセッサ,DSP,画像処理技術及び一般) , |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | |
| Paper # | SIP2004-88,ICD2004-120,IE2004-64 |
| Date of Issue |
| Conference Information | |
| Committee | SIP |
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| Conference Date | 2004/10/14(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
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| Vice Chair | |
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| Assistant | |
| Paper Information | |
| Registration To | Signal Processing (SIP) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | |
| Sub Title (in English) | |
| Keyword(1) | |
| 1st Author's Name | |
| 1st Author's Affiliation | () |
| Date | 2004-10-21 |
| Paper # | SIP2004-88,ICD2004-120,IE2004-64 |
| Volume (vol) | vol.104 |
| Number (no) | 363 |
| Page | pp.pp.- |
| #Pages | 67 |
| Date of Issue | |