| Presentation | 2003/4/18 Examples of Photonics Device Mounting Using High Precision Flip-Chip Bonding Eiji TANAKA, Masaaki YAMAMOTO, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Introduction of bonder's high precision positioning features that enabled mass production with 1 micron mounting accuracy, and explanation of actual mount examples. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | high precision bonding / phtonics device |
| Paper # | R2003-9,CPM2003-9,OPE2003-9 |
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| Conference Information | |
| Committee | R |
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| Conference Date | 2003/4/18(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Reliability(R) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Examples of Photonics Device Mounting Using High Precision Flip-Chip Bonding |
| Sub Title (in English) | |
| Keyword(1) | high precision bonding |
| Keyword(2) | phtonics device |
| 1st Author's Name | Eiji TANAKA |
| 1st Author's Affiliation | Shibuya Kogyo Co., Ltd.() |
| 2nd Author's Name | Masaaki YAMAMOTO |
| 2nd Author's Affiliation | Shibuya Kogyo Co., Ltd. |
| Date | 2003/4/18 |
| Paper # | R2003-9,CPM2003-9,OPE2003-9 |
| Volume (vol) | vol.103 |
| Number (no) | 33 |
| Page | pp.pp.- |
| #Pages | 3 |
| Date of Issue | |