| Presentation | 2003/4/18 Opto-electronic Chip-on-film (OE-COF) Packaging Technology Using Optical Waveguide Films with Low Coefficients of Thermal Expansion Mitsuo USUI, Shigeki ISHIBASHI, Nobutatsu KOSHOUBU, Suzuko ISHIZAWA, Hirooki HIRATA, Hideyuki TAKAHARA, |
|---|---|
| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | OE-COF packaging technology, including flip-chip bonded optical devices and LSIs on the optical waveguide film with impedance-matched electrical lines, was developed for over 10-Gbit/s transceiver modules. Self-aligned, mechanically reliable OE-COF was achieved by developing low-thermal-expansion OE film whose expansion coefficient was 1/6 that of the original OE film. Good optical interconnection characteristics were obtained by reducing of the optical return noise using refractive index matching cement between flip-chip bonded VCSEL and OE film surface. To evaluate the reliability of the Au-Sn solder bump connection, the thermal-shock test of -55℃-+125℃ was carried out. As a result, there was no change in the bonding strength after 1000 cycles, and it was confirmed to have a high thermal shock resistance. Impedance-matched copper co-planer waveguides formed on the surface of the OE film have -3 dB band width of 40GHz or more. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | OE-COF packaging / Au-Sn solder bump / OE film / Fluorinated polyimide |
| Paper # | R2003-8,CPM2003-8,OPE2003-8 |
| Date of Issue |
| Conference Information | |
| Committee | R |
|---|---|
| Conference Date | 2003/4/18(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Reliability(R) |
|---|---|
| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Opto-electronic Chip-on-film (OE-COF) Packaging Technology Using Optical Waveguide Films with Low Coefficients of Thermal Expansion |
| Sub Title (in English) | |
| Keyword(1) | OE-COF packaging |
| Keyword(2) | Au-Sn solder bump |
| Keyword(3) | OE film |
| Keyword(4) | Fluorinated polyimide |
| 1st Author's Name | Mitsuo USUI |
| 1st Author's Affiliation | NTT Microsystem Integration Laboratories() |
| 2nd Author's Name | Shigeki ISHIBASHI |
| 2nd Author's Affiliation | NTT Access Network Service Systems Laboratories |
| 3rd Author's Name | Nobutatsu KOSHOUBU |
| 3rd Author's Affiliation | NTT Microsystem Integration Laboratories |
| 4th Author's Name | Suzuko ISHIZAWA |
| 4th Author's Affiliation | NTT Microsystem Integration Laboratories |
| 5th Author's Name | Hirooki HIRATA |
| 5th Author's Affiliation | NTT Microsystem Integration Laboratories |
| 6th Author's Name | Hideyuki TAKAHARA |
| 6th Author's Affiliation | NTT Microsystem Integration Laboratories |
| Date | 2003/4/18 |
| Paper # | R2003-8,CPM2003-8,OPE2003-8 |
| Volume (vol) | vol.103 |
| Number (no) | 33 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |