Presentation 2003/4/18
Optical Interconnection on IC Chips for Future Ultra-High Speed O/E Packages
Atsushi ARATAKE, Tomoyuki AKEYOSHI, Masami TOKUMITSU,
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Abstract(in English) We have developed two types of monolithically-integrated polymeric optical interconnects on InP substrates with vertical-type uni-travelling-carrier photodiodes (UTC-PDs). We used simple and cost-effective polymeric optical waveguides as optical interconnects. Additionally, OE-probing system was developed for on-wafer measurement of optical devices. These techniques are promising ways to get cost-effective packages for future 100-Gbit/s class optical networks.
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Keyword(in English) Optical interconnection / Within a chip / 100Gbit-s / polymer / OEIC
Paper # R2003-7,CPM2003-7,OPE2003-7
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Conference Date 2003/4/18(1days)
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Language JPN
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Title (in English) Optical Interconnection on IC Chips for Future Ultra-High Speed O/E Packages
Sub Title (in English)
Keyword(1) Optical interconnection
Keyword(2) Within a chip
Keyword(3) 100Gbit-s
Keyword(4) polymer
Keyword(5) OEIC
1st Author's Name Atsushi ARATAKE
1st Author's Affiliation NTT Photonics Laboratories, NTT Corporation()
2nd Author's Name Tomoyuki AKEYOSHI
2nd Author's Affiliation NTT Photonics Laboratories, NTT Corporation
3rd Author's Name Masami TOKUMITSU
3rd Author's Affiliation NTT Photonics Laboratories, NTT Corporation
Date 2003/4/18
Paper # R2003-7,CPM2003-7,OPE2003-7
Volume (vol) vol.103
Number (no) 33
Page pp.pp.-
#Pages 5
Date of Issue