| Presentation | 2005/5/13 Newest Plating Technology : Environment Issue For Correspondent Alternative Technology Tomio HISHINUMA, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Pb Free / Sn Alloy-Plating / Sn-Ag / Sn-Cu / Sn-Bi / Non-Chromate / Cyanide Free Copper Electroplating |
| Paper # | EMD2005-10 |
| Date of Issue |
| Conference Information | |
| Committee | EMD |
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| Conference Date | 2005/5/13(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Electromechanical Devices (EMD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Newest Plating Technology : Environment Issue For Correspondent Alternative Technology |
| Sub Title (in English) | |
| Keyword(1) | Pb Free |
| Keyword(2) | Sn Alloy-Plating |
| Keyword(3) | Sn-Ag |
| Keyword(4) | Sn-Cu |
| Keyword(5) | Sn-Bi |
| Keyword(6) | Non-Chromate |
| Keyword(7) | Cyanide Free Copper Electroplating |
| 1st Author's Name | Tomio HISHINUMA |
| 1st Author's Affiliation | R&D Division, KEDC Corporation() |
| Date | 2005/5/13 |
| Paper # | EMD2005-10 |
| Volume (vol) | vol.105 |
| Number (no) | 70 |
| Page | pp.pp.- |
| #Pages | 9 |
| Date of Issue | |