Presentation 2005/5/13
Contact trouble phenomenon by organic silicon gas adsorption of Pd contact
Makito MORII,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) The phenomenon of the point of contact's occurring the contact trouble because of the silicone resin and oil is known well. The contact trouble phenomenon with silicon is generated within the constant range the opening and shutting load area. It is being confirmed by Oo researcher. The source of the silicon gas is requested not to recommend the device of high airtight type, and to be put on surroundings when using it by the pertinent load area to prevent trouble. The silicon material expands the range of use recently, and it is difficult to exclude the gas source. Moreover, the equipment that uses various point of contact materials is used. The trouble mechanism with silicon is examined around the silver point of contact so far. It reported that the trouble occurred in the area in the silver point of contact without the problem when the author used the material of the platinum metal. When thinking about the silicon synthesis in the point of contact as a chemical reaction, the influence that the surface adsorption time and the amount of the gas gave the reactiveness was examined in the report now. Because the character of the compound generated on the point of contact was considered, it reports.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Silver / palladium / organic silicon gas
Paper # EMD2005-7
Date of Issue

Conference Information
Committee EMD
Conference Date 2005/5/13(1days)
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Paper Information
Registration To Electromechanical Devices (EMD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Contact trouble phenomenon by organic silicon gas adsorption of Pd contact
Sub Title (in English)
Keyword(1) Silver
Keyword(2) palladium
Keyword(3) organic silicon gas
1st Author's Name Makito MORII
1st Author's Affiliation OMRON CO. LTD. ELECTRONIC COMPONENTS COMPANY TECHNOLOGY MANAGEMENT DEPT. ENGINEERING CENTER()
Date 2005/5/13
Paper # EMD2005-7
Volume (vol) vol.105
Number (no) 70
Page pp.pp.-
#Pages 6
Date of Issue