Presentation 2004/11/18
Copper-fluorocarbon composite thin films by prepared by RF sputtering
Satoru IWAMORI, Akihiro UEMURA,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Poly(tetrafluoroethylene) (PTFE)-copper (Cu) composite thin films were sputtered onto glass slides and evaluated size distributions of the Cu particles in the composite thin films. The particle size in the composite thin film sputtered at a pressure of SmTorr was smaller than that in the composite thin film sputtered at a pressure of 40 mTorr. Pull strength between the PTFE or PTFE-Cu composite thin films and Cu substrates was evaluated. The pull strength of PTFE/PTFE-Cu composite/Cu laminate was higher than that of PTFE/Cu laminate. In addition, the pull strength of the laminate containing the PTFE-Cu composite thin film sputtered at a pressure of 8mTorr was higher than that of 40mTorr.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) PTFE / Cu / Sputtering / distribution / pull strength
Paper # OME2004-96
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Conference Information
Committee OME
Conference Date 2004/11/18(1days)
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Paper Information
Registration To Organic Material Electronics (OME)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Copper-fluorocarbon composite thin films by prepared by RF sputtering
Sub Title (in English)
Keyword(1) PTFE
Keyword(2) Cu
Keyword(3) Sputtering
Keyword(4) distribution
Keyword(5) pull strength
1st Author's Name Satoru IWAMORI
1st Author's Affiliation Department of Human Mechanical Engineering, Graduate School of Natural Science and Engineering()
2nd Author's Name Akihiro UEMURA
2nd Author's Affiliation Department of Human Mechanical Engineering, Graduate School of Natural Science and Engineering
Date 2004/11/18
Paper # OME2004-96
Volume (vol) vol.104
Number (no) 453
Page pp.pp.-
#Pages 4
Date of Issue