Presentation 2005-05-27
A 3D Integration Scheme utilizing Wireless Interconnections for Implementing Hyper Brains
Atsushi Iwata, Mamoru Sasaki, Takamaro Kikkawa, Seiji Kameda, Hiroshi Ando, Kentaro Kimoto, Daisuke Arizono, Hideo Sunami,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) The 3D integration Custom Stack System (3DCSS) utilizing local wireless interconnect (LWI) and global wireless interconnect (GWI), is proposed. LWI transfers Gbps pulses using resonant coupling of spiral inductors with low power dissipation. Gb/s bit rate was obtained by the test chip measurement. The GWI utilizes high frequency electro-magnetic (EM) wave propagation using integrated antennas. EM wave propagation characteristics through stacked silicon substrates were measured using integrated dipole antennas. For implementing the hyper brain with real-time/high-level object recognition, the 3DCSS chip architecture has been developed.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Inductor / Antenna / Interconnection / Hyper Brain
Paper # ICD2005-37
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Conference Date 2005/5/20(1days)
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Registration To Integrated Circuits and Devices (ICD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A 3D Integration Scheme utilizing Wireless Interconnections for Implementing Hyper Brains
Sub Title (in English)
Keyword(1) Inductor
Keyword(2) Antenna
Keyword(3) Interconnection
Keyword(4) Hyper Brain
1st Author's Name Atsushi Iwata
1st Author's Affiliation Advanced Sciences of Matter, Hiroshima University()
2nd Author's Name Mamoru Sasaki
2nd Author's Affiliation Research Center for Nanodevices and Hiroshima University
3rd Author's Name Takamaro Kikkawa
3rd Author's Affiliation Research Center for Nanodevices and Hiroshima University
4th Author's Name Seiji Kameda
4th Author's Affiliation Research Center for Nanodevices and Hiroshima University
5th Author's Name Hiroshi Ando
5th Author's Affiliation Research Center for Nanodevices and Hiroshima University
6th Author's Name Kentaro Kimoto
6th Author's Affiliation Research Center for Nanodevices and Hiroshima University
7th Author's Name Daisuke Arizono
7th Author's Affiliation Research Center for Nanodevices and Hiroshima University
8th Author's Name Hideo Sunami
8th Author's Affiliation Research Center for Nanodevices and Hiroshima University
Date 2005-05-27
Paper # ICD2005-37
Volume (vol) vol.105
Number (no) 96
Page pp.pp.-
#Pages 6
Date of Issue