Presentation | 2005-01-28 On Finding Don't Cares in Test Sequences for Sequential Circuits and Applications to Test Compaction and Power Reduction Yoshinobu HIGAMI, Seiji KAJIHARA, Shinya KOBAYASHI, Yuzo TAKAMATSU, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | This paper presents a method for finding don't cares in test sequences while keeping the original stuck-at fault coverage. Here two methods are proposed for obtaining as many don't cares as possible, based on the method that utilizes fault simulation. Moreover as applications of test sequences including don't cares, power reduction method and test compaction method are proposed. By using the both methods, short test sequences with low power dissipation can be obtained. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | sequential circuit / test sequence / don't care / test compaction / power reduction |
Paper # | CPM2004-169,ICD2004-214 |
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Committee | ICD |
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Conference Date | 2005/1/21(1days) |
Place (in Japanese) | (See Japanese page) |
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Registration To | Integrated Circuits and Devices (ICD) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | On Finding Don't Cares in Test Sequences for Sequential Circuits and Applications to Test Compaction and Power Reduction |
Sub Title (in English) | |
Keyword(1) | sequential circuit |
Keyword(2) | test sequence |
Keyword(3) | don't care |
Keyword(4) | test compaction |
Keyword(5) | power reduction |
1st Author's Name | Yoshinobu HIGAMI |
1st Author's Affiliation | Department of Computer Science, Ehime University() |
2nd Author's Name | Seiji KAJIHARA |
2nd Author's Affiliation | Department of Computer Science and Electronics, Kyushu Institute of Technology |
3rd Author's Name | Shinya KOBAYASHI |
3rd Author's Affiliation | Department of Computer Science, Ehime University |
4th Author's Name | Yuzo TAKAMATSU |
4th Author's Affiliation | Department of Computer Science, Ehime University |
Date | 2005-01-28 |
Paper # | CPM2004-169,ICD2004-214 |
Volume (vol) | vol.104 |
Number (no) | 629 |
Page | pp.pp.- |
#Pages | 6 |
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