| Presentation | 2005-01-28 High reliability assurance method and its apprication on high density and large pin-count package Syuhei Hashimoto, Yassumasa Kawaguchi, Minoru Hanyu, Toshihiro Matsunaga, Mitsuhisa Matsuo, Naoko Kawatani, Yasuhisa Higuchi, Takahiko Takahashi, |
|---|---|
| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | In recent high density and large pin-count package becomes more complete and difficult due to fine pattern and multi layers construction. On the other hands we meet many cases that defects are not found with conventional life test and electrical characteristic test. Thus it becomes very important to study week point of in package development phase. In this paper we introduce physical analysis method of find microscopic defects that effect t the package reliability and on board evaluation method in which we focuses on the behavior of solder ball during LSI mounting on board. We also propose the new test method "Impact share test" which we developed for Pb free package. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Package / Reliability / Physical analysis / On board assembly / Lead free |
| Paper # | CPM2004-163,ICD2004-208 |
| Date of Issue |
| Conference Information | |
| Committee | ICD |
|---|---|
| Conference Date | 2005/1/21(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
|---|---|
| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | High reliability assurance method and its apprication on high density and large pin-count package |
| Sub Title (in English) | |
| Keyword(1) | Package |
| Keyword(2) | Reliability |
| Keyword(3) | Physical analysis |
| Keyword(4) | On board assembly |
| Keyword(5) | Lead free |
| 1st Author's Name | Syuhei Hashimoto |
| 1st Author's Affiliation | Hitachi, LTD. Micro Device Division() |
| 2nd Author's Name | Yassumasa Kawaguchi |
| 2nd Author's Affiliation | Hitachi, LTD. Micro Device Division |
| 3rd Author's Name | Minoru Hanyu |
| 3rd Author's Affiliation | Hitachi, LTD. Micro Device Division |
| 4th Author's Name | Toshihiro Matsunaga |
| 4th Author's Affiliation | Hitachi, LTD. Micro Device Division |
| 5th Author's Name | Mitsuhisa Matsuo |
| 5th Author's Affiliation | Hitachi, LTD. Micro Device Division |
| 6th Author's Name | Naoko Kawatani |
| 6th Author's Affiliation | Hitachi, LTD. Micro Device Division |
| 7th Author's Name | Yasuhisa Higuchi |
| 7th Author's Affiliation | Hitachi, LTD. Micro Device Division |
| 8th Author's Name | Takahiko Takahashi |
| 8th Author's Affiliation | Hitachi, LTD. Micro Device Division |
| Date | 2005-01-28 |
| Paper # | CPM2004-163,ICD2004-208 |
| Volume (vol) | vol.104 |
| Number (no) | 629 |
| Page | pp.pp.- |
| #Pages | 5 |
| Date of Issue | |