| Presentation | 2005/1/24 Effect of Additives on Bottom-up Electroless Copper Plating S. Shingubara, R. Obata, A. Kato, Z. Wang, O. Yaegashi, H. Sakaue, T. Takahagi, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | We found the bottom-up electroless plating of Cu by addition of SPS recently. In this study, effect of various additives such as alkanethiol and thiorea were investigated besides SPS. All these additives act as strong inhibitor for copper electroless plating. There was a clear bottom-up-fill effect for alkanethiol that had a hydrophilic unit. On the other hand, there was an anti-bottom-up effect for thiorea. These results suggested that there is a relationship between a molecular weight of inhibitor and the bottom-up-fill tendency. The bottom-up-fill occurs only when molecular weight is large enough, and it cannot occurs when molecular weight is much smaller than Cu-EDTA complex. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | copper interconnection / electroless plating / via hole / inhibitor / CMP |
| Paper # | SDM2004-243 |
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| Conference Information | |
| Committee | SDM |
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| Conference Date | 2005/1/24(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Silicon Device and Materials (SDM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Effect of Additives on Bottom-up Electroless Copper Plating |
| Sub Title (in English) | |
| Keyword(1) | copper interconnection |
| Keyword(2) | electroless plating |
| Keyword(3) | via hole |
| Keyword(4) | inhibitor |
| Keyword(5) | CMP |
| 1st Author's Name | S. Shingubara |
| 1st Author's Affiliation | Graduate School of ADSM, Hiroshima University() |
| 2nd Author's Name | R. Obata |
| 2nd Author's Affiliation | Graduate School of ADSM, Hiroshima University |
| 3rd Author's Name | A. Kato |
| 3rd Author's Affiliation | Graduate School of ADSM, Hiroshima University |
| 4th Author's Name | Z. Wang |
| 4th Author's Affiliation | Graduate School of ADSM, Hiroshima University |
| 5th Author's Name | O. Yaegashi |
| 5th Author's Affiliation | Graduate School of ADSM, Hiroshima University |
| 6th Author's Name | H. Sakaue |
| 6th Author's Affiliation | Graduate School of ADSM, Hiroshima University |
| 7th Author's Name | T. Takahagi |
| 7th Author's Affiliation | Graduate School of ADSM, Hiroshima University |
| Date | 2005/1/24 |
| Paper # | SDM2004-243 |
| Volume (vol) | vol.104 |
| Number (no) | 645 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |