| Presentation | 2005/1/24 Improvement in Reliability of Cu Dual-Damascene Interconnects Using CuAl Alloy Seed Kazuyoshi MAEKAWA, Kenichi MORI, Kiyoteru KOBAYASHI, Masahiro YONEDA, Niranjan Kumar, Schubert Chu, Samuel Chen, Gigi Lai, Daniel Diehl, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | In the present work, CuAl alloy seed was applied for 90nm node Cu dual-damascene interconnects and its effect on reliability improvement was studied. Via reliability of Cu interconnects using CuAl alloy seed was greatly improved without a remarkable increase in via resistance. A small amount of Al in Cu seems to help prevent the diffusion of vacancies and Cu atoms in Cu interconnects. Using CuAl alloy seed is one of the most promising and simple techniques to improve the via reliability of Cu interconnects for the 65nm node and beyond. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Interconnect / Dual-damascene / Reliability / Alloy seed / CuAl |
| Paper # | SDM2004-242 |
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| Conference Information | |
| Committee | SDM |
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| Conference Date | 2005/1/24(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
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| Vice Chair | |
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| Paper Information | |
| Registration To | Silicon Device and Materials (SDM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Improvement in Reliability of Cu Dual-Damascene Interconnects Using CuAl Alloy Seed |
| Sub Title (in English) | |
| Keyword(1) | Interconnect |
| Keyword(2) | Dual-damascene |
| Keyword(3) | Reliability |
| Keyword(4) | Alloy seed |
| Keyword(5) | CuAl |
| 1st Author's Name | Kazuyoshi MAEKAWA |
| 1st Author's Affiliation | Process Development Dept., Process Technology Development Div., Production and Technology Unit, Renesas Technology Corp.() |
| 2nd Author's Name | Kenichi MORI |
| 2nd Author's Affiliation | Process Development Dept., Process Technology Development Div., Production and Technology Unit, Renesas Technology Corp. |
| 3rd Author's Name | Kiyoteru KOBAYASHI |
| 3rd Author's Affiliation | Process Development Dept., Process Technology Development Div., Production and Technology Unit, Renesas Technology Corp. |
| 4th Author's Name | Masahiro YONEDA |
| 4th Author's Affiliation | Process Development Dept., Process Technology Development Div., Production and Technology Unit, Renesas Technology Corp. |
| 5th Author's Name | Niranjan Kumar |
| 5th Author's Affiliation | Applied Materials, Inc. |
| 6th Author's Name | Schubert Chu |
| 6th Author's Affiliation | Applied Materials, Inc. |
| 7th Author's Name | Samuel Chen |
| 7th Author's Affiliation | Applied Materials, Inc. |
| 8th Author's Name | Gigi Lai |
| 8th Author's Affiliation | Applied Materials, Inc. |
| 9th Author's Name | Daniel Diehl |
| 9th Author's Affiliation | Applied Materials Japan Inc. |
| Date | 2005/1/24 |
| Paper # | SDM2004-242 |
| Volume (vol) | vol.104 |
| Number (no) | 645 |
| Page | pp.pp.- |
| #Pages | 4 |
| Date of Issue | |