Presentation 2005/1/24
Strategy for Highly-Reliable Porous Low-k Films : Mechanism of Time-Dependent Dielectric-Constant Increase (TDDI)
Daisuke RYUZAKI, Haruaki SAKURAI, Koichi ABE, Kenichi TAKEDA, Hiroshi FUKUDA,
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Abstract(in English) The mechanism of the dielectric-constant increase in porous organosilicate glasses (OSGs) under electric-field stress has been revealed for the first time, where the dielectric-constant increase is caused by the oxidation of methyl groups in porous OSGs. By optimizing the methyl content, the authors developed a highly reliable, novel low-k porous OSG (k=2.3) with a dielectric-constant lifetime of 10^3 years for the 65-nm generation and beyond. The newly developed porous OSG was successfully integrated into 240-nm-pitch copper interconnects, where the line-to-line capacitance shows a much longer lifetime than the case of conventional porous OSGs.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Low-k / TDDI / Dielectric constant / Lifetime / Reliability
Paper # SDM2004-239
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Committee SDM
Conference Date 2005/1/24(1days)
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Registration To Silicon Device and Materials (SDM)
Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Strategy for Highly-Reliable Porous Low-k Films : Mechanism of Time-Dependent Dielectric-Constant Increase (TDDI)
Sub Title (in English)
Keyword(1) Low-k
Keyword(2) TDDI
Keyword(3) Dielectric constant
Keyword(4) Lifetime
Keyword(5) Reliability
1st Author's Name Daisuke RYUZAKI
1st Author's Affiliation Central Research Laboratory, Hitachi, Ltd.()
2nd Author's Name Haruaki SAKURAI
2nd Author's Affiliation Semiconductor Materials Business Unit, Hitachi Chemical Co., Ltd.
3rd Author's Name Koichi ABE
3rd Author's Affiliation Semiconductor Materials Business Unit, Hitachi Chemical Co., Ltd.
4th Author's Name Kenichi TAKEDA
4th Author's Affiliation Central Research Laboratory, Hitachi, Ltd.
5th Author's Name Hiroshi FUKUDA
5th Author's Affiliation Central Research Laboratory, Hitachi, Ltd.
Date 2005/1/24
Paper # SDM2004-239
Volume (vol) vol.104
Number (no) 645
Page pp.pp.-
#Pages 6
Date of Issue