| Presentation | 2005/2/11 A Study on Lead Free Soldering Connection for Throuhole PWB (3) Sadanori ITO, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | In this paper we describe on an indicator of reliability test for lead free products. This is explained about tha change of strangth by strain speed and temperature, a variety of copper leaching by solder-material, and growth mechanism of whisker. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Lead Free Soldering / Cupper Leaching / tin whisker / intermetalics / diffusion |
| Paper # | R2004-66,EMD2004-108 |
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| Conference Information | |
| Committee | R |
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| Conference Date | 2005/2/11(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Reliability(R) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | A Study on Lead Free Soldering Connection for Throuhole PWB (3) |
| Sub Title (in English) | |
| Keyword(1) | Lead Free Soldering |
| Keyword(2) | Cupper Leaching |
| Keyword(3) | tin whisker |
| Keyword(4) | intermetalics |
| Keyword(5) | diffusion |
| 1st Author's Name | Sadanori ITO |
| 1st Author's Affiliation | omron co. ltd.() |
| Date | 2005/2/11 |
| Paper # | R2004-66,EMD2004-108 |
| Volume (vol) | vol.104 |
| Number (no) | 660 |
| Page | pp.pp.- |
| #Pages | 8 |
| Date of Issue | |