Presentation | 2004/11/5 Blocking Capability of SOI-LIGBTs Imposed thermal and Electrical Stress Hitoshi Sumida, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | Long-term reliability of high-voltage lateral IGBTs on SOI is reported. Thermal and electrical stress was constantly imposed on the devices during 1000 hours. The breakdown voltages of the devices were measured at a certain time for the duration of the test. These results together with the failure analysis of the devices with the deteriorated characteristics are shown in this paper. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | high-voltage lateral IGBT / SOI / blocking capability / thermal and electrical stress / failure analysis |
Paper # | R2004-41,ED2004-154 |
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Conference Information | |
Committee | ED |
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Conference Date | 2004/11/5(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
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Assistant |
Paper Information | |
Registration To | Electron Devices (ED) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Blocking Capability of SOI-LIGBTs Imposed thermal and Electrical Stress |
Sub Title (in English) | |
Keyword(1) | high-voltage lateral IGBT |
Keyword(2) | SOI |
Keyword(3) | blocking capability |
Keyword(4) | thermal and electrical stress |
Keyword(5) | failure analysis |
1st Author's Name | Hitoshi Sumida |
1st Author's Affiliation | Fuji Electric Device Technology Co., Ltd.() |
Date | 2004/11/5 |
Paper # | R2004-41,ED2004-154 |
Volume (vol) | vol.104 |
Number (no) | 428 |
Page | pp.pp.- |
#Pages | 6 |
Date of Issue |