Presentation 2004/11/5
Blocking Capability of SOI-LIGBTs Imposed thermal and Electrical Stress
Hitoshi Sumida,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) Long-term reliability of high-voltage lateral IGBTs on SOI is reported. Thermal and electrical stress was constantly imposed on the devices during 1000 hours. The breakdown voltages of the devices were measured at a certain time for the duration of the test. These results together with the failure analysis of the devices with the deteriorated characteristics are shown in this paper.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) high-voltage lateral IGBT / SOI / blocking capability / thermal and electrical stress / failure analysis
Paper # R2004-41,ED2004-154
Date of Issue

Conference Information
Committee ED
Conference Date 2004/11/5(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To Electron Devices (ED)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Blocking Capability of SOI-LIGBTs Imposed thermal and Electrical Stress
Sub Title (in English)
Keyword(1) high-voltage lateral IGBT
Keyword(2) SOI
Keyword(3) blocking capability
Keyword(4) thermal and electrical stress
Keyword(5) failure analysis
1st Author's Name Hitoshi Sumida
1st Author's Affiliation Fuji Electric Device Technology Co., Ltd.()
Date 2004/11/5
Paper # R2004-41,ED2004-154
Volume (vol) vol.104
Number (no) 428
Page pp.pp.-
#Pages 6
Date of Issue