Presentation 2005-01-28
On Finding Don't Cares in Test Sequences for Sequential Circuits and Applications to Test Compaction and Power Reduction
Yoshinobu HIGAMI, Seiji KAJIHARA, Shin-ya KOBAYASHI, Yuzo TAKAMATSU,
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Abstract(in English) This paper presents a method for finding don't cares in test sequences while keeping the original stuck-at fault coverage. Here two methods are proposed for obtaining as many don't cares as possible, based on the method that utilizes fault simulation. Moreover as applications of test sequences including don't cares, power reduction method and test compaction method are proposed. By using the both methods, short test sequences with low power dissipation can be obtained.
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Keyword(in English) sequential circuit / test sequence / don't care / test compaction / power reduction
Paper # CPM2004-169,ICD2004-214
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Committee CPM
Conference Date 2005/1/21(1days)
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Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) On Finding Don't Cares in Test Sequences for Sequential Circuits and Applications to Test Compaction and Power Reduction
Sub Title (in English)
Keyword(1) sequential circuit
Keyword(2) test sequence
Keyword(3) don't care
Keyword(4) test compaction
Keyword(5) power reduction
1st Author's Name Yoshinobu HIGAMI
1st Author's Affiliation Department of Computer Science, Ehime University()
2nd Author's Name Seiji KAJIHARA
2nd Author's Affiliation Department of Computer Science and Electronics, Kyushu Institute of Technology
3rd Author's Name Shin-ya KOBAYASHI
3rd Author's Affiliation Department of Computer Science, Ehime University
4th Author's Name Yuzo TAKAMATSU
4th Author's Affiliation Department of Computer Science, Ehime University
Date 2005-01-28
Paper # CPM2004-169,ICD2004-214
Volume (vol) vol.104
Number (no) 627
Page pp.pp.-
#Pages 6
Date of Issue