| Presentation | 2005-01-27 Examination of highly reliable Sn-Ag-X Pb-free solder Masazumi AMAGAI, Tsukasa OHNISHI, Takeshi TASHIMA, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Sn-Ag-Cu alloys are leading candidates for lead free solders. However, Sn-Ag-Cu alloys were not satisfied to meet severe customer requirements. At first, optimum silver wt% was investigated to get the balance of drop, thermal cycling, bend test performance and solder internal voids. Addition elements were subsequently studied while observing reliability performance. Based on the results of board level reliability tests, new lead free solder has been developed. This paper presents the optimum Nickel and Indium elements in Sn-Ag based solder alloys. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Lead free solder / Reliability / Drop test / Void / Nickel / Indium |
| Paper # | CPM2004-161,ICD2004-206 |
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| Conference Information | |
| Committee | CPM |
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| Conference Date | 2005/1/20(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
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| Vice Chair | |
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| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Examination of highly reliable Sn-Ag-X Pb-free solder |
| Sub Title (in English) | |
| Keyword(1) | Lead free solder |
| Keyword(2) | Reliability |
| Keyword(3) | Drop test |
| Keyword(4) | Void |
| Keyword(5) | Nickel |
| Keyword(6) | Indium |
| 1st Author's Name | Masazumi AMAGAI |
| 1st Author's Affiliation | Modeling & Characterization Group, Tsukuba Technology Center, Texas Instruments Japan() |
| 2nd Author's Name | Tsukasa OHNISHI |
| 2nd Author's Affiliation | R&D Technicalcenter, Senju Metal Industry Co., LTD |
| 3rd Author's Name | Takeshi TASHIMA |
| 3rd Author's Affiliation | R&D Technicalcenter, Senju Metal Industry Co., LTD |
| Date | 2005-01-27 |
| Paper # | CPM2004-161,ICD2004-206 |
| Volume (vol) | vol.104 |
| Number (no) | 626 |
| Page | pp.pp.- |
| #Pages | 4 |
| Date of Issue | |